| Tightsen epoxy adhesives are widely used for bonding metals, ceramics, woods, glass and some plastics etc.. Can be used for structural bonding, encapsulating parts, with high strength and volume unshrinking characters. |
| Epoxy structural adhesive series |
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TSE120 Epoxy structural adhesive
▲High impact and high peel strength and excellent mechanical and electric insulation characters.
▲Bond dissimilar materials including aluminum, steel, and other metals, as well as a variety of plastics and ceramics. |
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TSE301 Epoxy structural adhesive
▲Fast curing.
▲For bonding metal, plastic, wood etc..
▲High strength, resistant to impact and peel-off. |
TSE302 Epoxy structural adhesive
▲Fast cure speed, high bonding strength.
▲Not to corrosive pipe fitting, resistant to solvent and medium.
▲For bonding metal, ceramics, concrete and glass etc.. |
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TSE310 Epoxy structural adhesive
▲One compenent, heat cure, low viscosity, good flowable.
▲Can be used for structural bonding metals, ceramics, glass and encapsulating some small electric parts. |
TSE311 Epoxy structural adhesive
▲One compenent, high temperature cure, high bonding strength,easy to use, widely applicability.
▲Can be used for structural bonding metals, ceramics, and glass etc.. |
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| Underfill adhesive |
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TSE3513 Underfill adhesive
▲Reworkable underfill for CSP (FBGA) or BGA. Dispense product at moderate speed .Ensure that needle tip is about 0.025mm.
▲It is designed to give excellent protection from failure due to mechanical stress,include: hand dispense and notebook PC. The low viscosity allows filling in gaps under CSP or BGA. |
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| Polymer backing adhesive series |
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TSE-201 Polymer backing adhesive
▲High performance 100% epoxy resin formulated for maximum protection and possitive support of wear liners of cone ctushers, gyratory crushers,griding mills etc..
▲No melting or special equipment needed in application,designed as alternatives to dangerous and costly molten zinc pours.
▲Low volume shrinking after curing, excellent gap filling ability. eliminates gaps between liners .
▲Easy and safe mixing and application.
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TSE202 Polymer backing adhesive
▲High performance 100% resin formulated for maximum protection and positive support of wear liners of cone crushers, gyratory crushers, griding mills etc.. Cured in room temperature.
▲No melting or special equipment needed in application, low volume shrinking , eliminates gaps between liners. Easy and safe mixing and application.
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| Epoxy encapsulant adhesive |
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TSE501 Epoxy encapsulant adhesive
▲Better flowable, high bonding strength, easy to use and excellent electricity capability.
▲Can encapsulate capacitance, transformer, amplifier, relay etc.. |
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TSE502 Epoxy encapsulant adhesive
▲Better flowable, high bonding strength, easy to use and excellent electricity capability.
▲Can encapsulate capacitance, transformer, amplifier, relay etc.. |
TSE506 Epoxy encapsulant adhesive
▲Better flowable, high bonding strength, easy to use and excellent electricity capability.
▲Can encapsulate capacitance, transformer, amplifier, relay etc.. |
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Technical Specification
Product |
Container |
Color |
ViscositymPa.S) |
Mix ratio(By weight) |
Operating time(25οC) |
Full cure time (25οC) |
Tensil shear strength (MPa) |
Compressive strength (MPa) |
Hardness (Shore D) |
TSE-201 |
22.5kg |
Brown |
85000 |
100:6 |
30min(500g) |
8hrs |
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105 |
90 |
TSE202 |
22.5kg |
Brown |
18000 |
200:1 |
30min(100g) |
8hrs |
/ |
105 |
90 |
TSE120 |
1kg |
Yellowish |
30000~50000 |
2:1 |
2hrs(500g) |
24hrs |
> 30 |
/ |
83 |
TSE-301 |
50g/100g |
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50000 |
1:1 |
3分(20g) |
24hrs |
12 |
97 |
80 |
TSE-302 |
50g/1kg |
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20000~25000 |
1:1 |
15min(100g) |
4hrs |
14 |
/ |
82 |
TSE310 |
500g |
Green |
25000 |
/ |
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1hrs/120 οC |
> 12 |
9~11 |
80 |
TSE-311 |
500g |
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150000 |
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12 |
9~11 |
80 |
TSE-501 |
1kg |
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2500 |
4:1 |
50min(250g) |
12hrs |
12 |
110 |
80-85 |
TSE-502 |
1kg |
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6000 ~8000 |
4:1 |
2hrs(100g) |
24hrs |
15 |
10~13 |
80-85 |
TSE506 |
1kg |
Clear |
1000~1500 |
3:1 |
50min(500g) |
12hrs |
> 11 |
10~13 |
80~85 |
TSE3513 |
500g |
Yellowish |
9000~14000 |
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15min/120 οC 10min/150 οC |
13 |
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82 |
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