Thermosetting Polyimid SolverPI-Powder 1800

Application: SolverPI-Powder1800 is suitable to composite with reinforcing materials, such as PTFE, graphite, molybdenum disulfide. Which can effectively improve the heat resistance, abrasion resistance, and dimensional stability. When we composite SolverPI-Powder 1800 with other material, other material is the base material. Currently most popular material is PTFE. SPECIFICATIONS: Appearance Yellow powder Fineness 1000 Meshes Density 1.40~1.45g/cm3 Glass transition temperature 385°C Thermal expansion coefficient 20~25ppm/°C Permissions on the oxygen index 37 The compression strength ≧160MPa The bending strength ≧180MPa The impact strength ≧100KJ/M² Surface resistivity ≧10³Ω Volume resistivity ≧10³Ω.cm Dielectric constant(106Hz) 3.0~3.5 Dielectric strength（KV/mm) 240 Because the toughness and adhesion of the first genaration thermosetting superfine moulding powder (SolverPI-Powder 1800) is poor, not suitable for pressing parts alone, so nowdays the main use of the first generation powder is used to compounded with PTFE is modified after use,composite by using PTFE as the main body. The purpose of composite: 1. PTFE has good corrosion resistance and wear resistance and self lubrication, adhesion is good, but its mechanical strength is low, creep resistance is poor, easy heat expansion. 2. SolverPI-Powder 1800 is used to enhance PTFE to improve its performance. 3. Composite PTFE with SolverPI-Powder 1800 can excellent performance integrated fro m both. This composite product can make parts with good formability properties and better creep resistance and better mechanical strength. The PTFE composit product with 25% SolverPI-Powder 1800, can reduce Thermal expansion rate by 50% Photo of The PTFE composit product: For the temperature resistance, wear resistance, insulationresistance and dimensional stability, thermosetting PI is significantly BETTER than PEEK and PTFE. Performance comparison between Thermosetting PI with PTFE and PEEK Material PTFE PEEK Thermosetting Polyimide The Melting/℃ 330 343 - The glass transition temperature/℃ - 143 385 Thermal deformation temperature/℃ 120 156 360 Linear expansion rate/10-5/℃ 10.3-12.8(~200℃) 4.7 (<143℃) 10.8 (>143℃) 3.5-5.0(~300℃) The elongation at break/% 250-500 150 <5 Density 2.15-2.2 1.26-1.32 1.42-1.44 The coefficient of friction 0.13-0.16 0.3-0.38 0.29-0.39 The critical surface temperature for the Non lubricated bearings to various materials 260 260 390 The critical value of PV for the Non lubricated bearings to various materials (MPa.m/min) 5.2 145 895 Dielectric strength /KV/mm 17-24 16-21 100-200 Dielectric constant 2.1 3.2 (0-150℃) 4.5 (200℃) 3.5-3.6 Pure PTFE gasket: Poor creep properties, linear expansion coefficient is high, low strength, low use temperature. Composite modified PTFE with SolverPI-Powder 1800: Linear expansion coefficient decreased obviously , mechanical strength increased, the use temperature increased.