Alternative to FUJIMI Imported FO Polishing Powder #1200
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Alternative to FUJIMI Imported FO Polishing Powder #1200
FO is an alumina-zirconia composite polishing powder, characterized by combining the self-sharpening and toughness of both alumina and zirconia. The addition of silica and zirconia results in a moderate hardness of the polishing powder, preventing surface damage to wafers or crystals. It is suitable for grinding and polishing semiconductor materials such as gallium arsenide, gallium phosphide, silicon wafers, as well as optical lenses and optical glass.
Chemical Composition:
Component | Guaranteed Value | Typical Value |
|---|---|---|
Al2O3 | 45-57% | 50.88% |
ZrO2 | 28-33% | 32.11% |
SiO2 | 11-20% | 15.35% |
TiO2 | 0.8-2.0% | 1.03% |
Fe2O3 | ＜0.1% | 0.10% |
Physical Properties:
Color | White |
|---|---|
Specific Gravity | ≥3.9g/cm³, Measured Value: 4.1-4.3g/cm³ |
Mohs Hardness | 9.0 |
Production Specifications:
Grit Size | D0(Micron) | D3(Micron) | D50(Micron) | D94(Micron) |
|---|---|---|---|---|
#240 | ≤ 93.1 | ≤ 71.8 | 41.5±3.2 | ≥ 28.7 |
#280 | ≤ 81.4 | ≤ 64.1 | 35.2±2.7 | ≥ 22.8 |
#320 | ≤ 70.6 | ≤ 56.3 | 28.8±2.5 | ≥ 18.1 |
#400 | ≤ 64.3 | ≤ 50.2 | 24.6±2.3 | ≥ 15.5 |
#500 | ≤ 54.3 | ≤ 43.3 | 20.4±1.7 | ≥ 13.2 |
#600 | ≤ 46.3 | ≤ 37.4 | 17.1±1.4 | ≥ 11.0 |
#700 | ≤ 39.3 | ≤ 31.5 | <极>14.5±1.2 | ≥ 8.7 |
#800 | ≤ 33.3 | ≤ 27.5 | 12.0±1.0 | ≥ 7.0 |
#1000 | ≤ 21 | ≤ 14.7 | 10.3±0.3 | ≥ 7.0 |
#1200 | ≤ 18 | ≤ 11.8 | 7.2±0.3 | ≥ 4.2 |
#1500 | ≤ 14 | ≤ 10.0 | 5.8±0.5 | ≥ 3.5 |
#2000 | ≤ 13 | ≤ 9.0 | 4.7±0.5 | ≥ 2.6 |
#3000 | ≤ 10.0 | ≤ 6.3 | 3.7±0.4 | ≥ 1.7 |
#4000 | ≤ 8.5 | ≤ 5.4 | 2.8±0.4 | ≥ 极1.5 |
#6000 | ≤ 8.0 | ≤ 5.0 | 2.0±0.4 | ≥ 0.8 |
Product Application Scope:
1) Electronics Industry: Grinding and polishing of semiconductor single-crystal silicon wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).
2) Glass Industry: Grinding and polishing of optical glass crystals.
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