ESD-sensitive devices

Devices and parts vulnerable to ESD damage

Devices and parts vulnerable to ESD damage:

Devices and parts vulnerable to ESD damage:

1. Structure: small chip size, small heat capacity, small signal device, high-frequency device, micro-metallization, shallow EB junction, thin gate, oxide layer, etc.

Structure: small chip size, small heat capacity, small signal device, high-frequency device, micro-metallization, shallow EB junction, thin gate, oxide layer, etc.

2. Parts: the high resistance part of the input circuit and the output circuit, the edge of the metallized zone and other areas.

Parts: the high resistance part of the input circuit and the output circuit, the edge of the metallized zone and other areas.

For any questions or business inquiries, please call Ms. Huang at 15513049001. Jinding Yucheng Certification will provide you with services.