EPOTEK301-2

EPO-TEK® 301-2FL is a two-component, optical and semiconductor-grade epoxy. It is a more flexible version of EPO-TEK® 301-2.

This product resists yellowing after more than 17 days of continuous UV exposure. Suitable for LED encapsulation. Light transmittance can reach 98%.
* Easy to use: encapsulation and casting.
* Semiconductor applications: underfill for flip-chip packaging, wire bonding at the global level, spin coating at the wafer level including wafer-level packaging.
* Flexible adhesive, resistant to impact or vibration. Low-stress adhesive for bonding optics inside OEM/scientific instruments. Optical fiber adhesive: bundling fibers, terminating optical fibers into ferrules, mounting optical fiber components, bonding glass cover slips in V-grooves; spectral transmission for visible and infrared light.
* Biocompatible and non-toxic, compliant with USP Class VI biocompatibility standards for medical devices and implant applications.
* Excellent adhesion to glass, crystal, metals, wood, and most plastics.
* Can also be used for pseudo-restoration by impregnating wood or porous objects.
* Suitable for low-temperature cooling applications. Good impact performance, low viscosity, biocompatibility, low VOC, excellent adhesion, non-toxic.