Bostik 861HV Low Pressure Injection Molding Hot Melt Adhesive

Low-pressure injection molding hot melt adhesive is primarily used in low-pressure injection molding processes. It is a malleable adhesive that changes its physical state within a certain temperature range while maintaining its chemical properties, making it an environmentally friendly chemical product. Its application areas are very broad, mainly used for the encapsulation and protection of precision and sensitive electronic components to achieve functions such as insulation, resistance to high and low temperatures, impact resistance, vibration damping, moisture resistance, waterproofing, dust resistance, oil resistance, and chemical corrosion resistance. Polyamide hot melt adhesive is a high-molecular thermoplastic polyamide resin synthesized from dimerized fatty acids. These fatty acids are derived from renewable resources such as soybeans, rapeseed, and sunflower seeds, and are then polycondensed into dimers. During the polycondensation process, the dimerized fatty acids react with diamines, releasing water and forming polyamide hot melt adhesive. This product is non-corrosive, odorless, exhibits strong adhesion to various substrates, and has low melt viscosity with good fluidity. Product features: 1. Extremely low injection pressure, ensuring no damage to components 2. Excellent adhesion to various plastics (such as PVC, PA66, PC, ABS, etc.) and metals. The product quality is guaranteed, with reasonable pricing and fast delivery.