Second-hand 40B Large Size Double-Sided Polishing Machine, Surface Grinding Machine, Thinning Machine for Transfer

Second-hand large-size polishing machine Japan Sōgi 40B double-sided polishing machine Large double-sided grinding and polishing machine detailed introduction
This machine is suitable for double-sided precision grinding processing of silicon wafers, quartz wafers, ceramic wafers, gallium arsenide wafers, and other hard and brittle materials.
Main features:
1. Inverter combined with asynchronous motor drive achieves soft start, soft stop, stable speed regulation, and low impact.
2. Dual-motor synchronous drive is adopted, with a wider sun gear speed range, capable of adapting to different grinding process requirements.
3. Synchronous lifting of the sun gear and internal gear ring meets the requirements for loading/unloading workpieces and adjusting the idler gear engagement position.
4. Upper and lower grinding discs adopt helical gear transmission, improving operational stability.
5. Pressure is controlled by electro-pneumatic proportional valve closed-loop feedback, making pressure level setting more convenient, operation simple and easy, and work reliable and stable.
6. This machine uses a human-machine interface (HMI) terminal display, which on one hand displays operating parameters, and on the other hand allows adjustment and setting of various process parameters through its touch keys. Main operations are completed by ordinary buttons.
7. The design and internal structure fully consider reliability, practicality, interchangeability, and the convenience of operation and maintenance.