Super Depth of Field Composite Measurement Digital Microscope

Basic Functions

1. Real-time imaging: 3D electron microscopes can directly convert optical images into electronic signals and display them in real-time on a computer screen. Users can observe and analyze samples instantly without waiting.

2. Image capture and saving: Electron microscopes can capture static images and save them in various file formats, such as JPEG, PNG, TIFF, etc. The captured images can be used for reports, analysis, or further editing and processing.

3. Video recording: Many electron microscopes support video recording, allowing users to capture dynamic processes or long-term observations. Recorded videos can be saved in multiple formats, such as MP4, AVI, etc., facilitating post-editing and sharing.

4. Measurement and analysis: Electron microscopes typically provide measurement tools, such as length, area, angle, and volume. Analysis functions may include color analysis, particle counting, morphological analysis, etc.

3D microscopes have advantages in defect inspection because they provide height information and stereoscopic images of an object's surface, revealing details that traditional 2D microscopes might overlook. Here are some specific examples:

1. Metal surface crack detection:

In industries such as automotive manufacturing, aerospace, and electronics manufacturing, 3D microscopes can be used to inspect surface defects of metal, plastic, or ceramic parts, such as scratches, cracks, or unevenness. Through the stereoscopic images provided by 3D microscopes, engineers can more accurately assess the depth and shape of defects to determine whether repair or replacement is needed, helping engineers evaluate the impact of cracks on structural integrity.

2. Electronics manufacturing defect analysis:

In electronics manufacturing, the quality of PCBs directly affects the performance of electronic products. 3D microscopes can be used to inspect solder joints, circuits, and connectors on PCBs to identify defects such as short circuits, open circuits, solder bridges, or incomplete solder joints. Through 3D microscopes, quality inspectors can clearly see the three-dimensional shape of solder joints, ensuring they meet design specifications. Solder joint inspection: Can be used to check the shape, size, and continuity of solder joints, ensuring there are no issues like cold solder, false soldering, or excessive solder, which could lead to reduced device performance or failure. Integrated circuit analysis: Can be used to analyze surface defects, connection lines, and solder joint quality of ICs, as well as the integrity of packaging. Through three-dimensional imaging, microscopic defects can be more accurately identified and repaired, improving the reliability and performance of ICs.

3. Wire connection inspection:

In the manufacturing of micro-wires or flexible circuits, the integrity of connections is crucial for signal transmission. 3D microscopes can be used to inspect connection points of wires to ensure there are no breaks or corrosion, thereby ensuring stable signal transmission.

4. Three-dimensional packaging inspection:

As electronic products become more miniaturized, three-dimensional packaging technology is becoming increasingly common. 3D microscopes can be used to inspect the internal structure of three-dimensional packaging, including silicon bumps, micro-balls, and redistribution layers (RDLs), ensuring the robustness and performance of the packaging.

5. Material analysis:

In electronics manufacturing, the microstructure of materials affects the thermal, electrical, and mechanical properties of products. 3D microscopes can be used to analyze the three-dimensional structure of materials, such as internal defects in plastic packaging or the grain structure of metal conductors, thereby optimizing material selection and manufacturing processes.

6. Semiconductor chip surface inspection:

Surface defects on semiconductor chips may cause circuit failures. 3D microscopes can be used to inspect the flatness, scratches, contamination, or other microscopic defects on chip surfaces. Through 3D imaging, the depth and size of defects can be accurately measured, which is crucial for determining whether defects will affect chip functionality.

7. Defect detection in rubber and plastic components: In the automotive and consumer electronics industries, defects in rubber and plastic components may affect product usability and appearance. 3D microscopes can be used to inspect the surfaces of these components to identify bubbles, impurities, cracks, or other irregularities. The height information provided by 3D microscopes can help manufacturers determine whether defects are within acceptable limits.

8. Quality control of optical components:

For optical components such as lenses and mirrors, minor surface defects can cause image distortion. 3D microscopes can be used to inspect the surfaces of these components to identify scratches, dents, or other flaws. Through 3D microscopes, manufacturers can ensure the surface quality of optical components meets high-precision requirements.

9. Reverse engineering: In reverse engineering, 3D microscopes can be used to analyze competitors' products or outdated components for which no drawings exist. By creating three-dimensional models of these components, engineers can better understand their design and functionality and potentially innovate or improve upon them.

These examples illustrate the capability of 3D microscopes in defect inspection. By providing detailed three-dimensional information, they help manufacturers and engineers more accurately assess product quality and performance, ensuring product reliability and safety. These cases demonstrate that 3D microscopes play a critical role in electronics manufacturing, helping manufacturers improve product quality and reliability, reduce failure rates, and promote innovation and optimization in the manufacturing process, thereby enhancing customer satisfaction.