SPEA Flying Probe Tester

Replaceable Bed-of-Nails Tester

SPEA flying probe testers can easily replace traditional bed-of-nails systems for batch production;

80 boards tested per hour, over 630,000 boards tested annually, with automatic online loading and unloading in 2.5 seconds;

Actual data is based on a panel containing 4 single boards, 950 nodes, and 700 components;

Reliable Contact with Micro Pads

The precision of probe contact allows our equipment to reliably test tiny SMD components, Probe Card connection pins, and male/female connectors (e.g., backplane testing);

Capable of probing pads as small as 50μm with an accuracy of 10μm;

No Fixture Costs

With SPEA flying probe testers, customers can eliminate all related expenses;

Fixture development and production, laboratory testing during R&D (SPEA flying probes are always ready for testing), fixture multiplication for multiple production lines;

If the product layout changes, fixtures would need redesigning—maintenance and periodic replacement costs are saved;

Reduced Field Repairs

SPEA testers can measure key parameters of critical components in circuits (e.g., power devices, sensors, actuators), effectively identifying defective components (causing premature failure) and reducing field repairs;

Early fault detection minimizes economic losses in later stages/processes, simplifies functional testing equipment, and reduces functional test time;

Precision Probing of Tiny SMDs

Miniaturization continues, and SPEA flying probe systems are future-ready. Linear optical encoders on each X-Y-Z axis enable precise positioning, providing real-time feedback on probe position;

High-performance linear optical encoders on XYZ axes ensure reliable contact with micro-SWD (008004) pads;

Reliable testing of flexible/thin printed circuits, stable long-term positioning measurement for flex/PCBs;

High-speed soft-landing technology: No contact damage, zero pressure on PCBs and micro-SMDs;

Measurement Accuracy

Shorter distance between probes and measurement units ensures greater accuracy. Based on this fundamental circuit principle, SPEA designed a highly unique flying probe tester;

Drive and measurement units are integrated into each flying probe head, significantly enhancing measurement speed and performance;

High measurement performance and accuracy (0.1pF), signal integrity with no attenuation or interference, real-time signal acquisition;

Visual Programming

Automatically generate test programs within minutes, with or without CAD files. The new S2 control system reduces test program generation time by 50%;

Fast, comprehensive automatic debugging and optimization; software for automated PCB repair, automatic import of X-Y files, compatibility with Built-In Self-Test (BIST), user-friendly graphical interface, and control software for monitoring, analyzing, and optimizing production processes;