VT-X750 High-Speed CT Type X-Ray Automatic Inspection System
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1: Visualization of Solder Joint Strength
Through this model's 3D-CT reconstruction algorithm, it reproduces the required solder fillet shape with highly consistent repeat accuracy. By quantitatively inspecting the solder shape and mounting conditions, it achieves quality inspections that meet industry standards, minimizes the risk of missed defects, and enables quick and stable quality responses during production changes.
<2: Design Changes Without Constraints
As substrates become smaller, design changes often require high-density mounting or stacked mounting. Using 3D-CT X-ray technology for production validation eliminates constraints caused by unverified manufacturing processes.
3: Reduced Radiation Exposure
3.1) High-Speed Imaging Technology
While maintaining inspection image quality, radiation exposure is reduced through high-speed imaging technology.
3.2) X-Ray Source Located at the Bottom of the Device
Most mounted substrates place critical components on the TOP side. Since the radiation source irradiates from below, it physically reduces radiation exposure to densely packed critical components on the TOP side.
3.3) Standard Radiation-Reducing Filter
The equipment comes standard with a filter that directly reduces radiation exposure, offering enhanced protection for sensitive components such as memory and flash storage.
3.4) Ultra-Low Leakage Design
Operator radiation exposure is limited to within 0.18mSv*3 per year, equivalent to 1/10 of natural environmental radiation exposure.
(*3: Based on a programming operator working 1 hour per day on average) 0.5μSv/h × 1h/day × 365 days = 0.183mSv
Method Based on AI "Humanization"
Standard Setting/Automatic Judgment Without Relying on Specialists In addition to quantitative judgment based on conventional inspection standards, OK/NG judgments can be comprehensively determined by AI. (A cross-sectional 3D display function has been added to the standard inspection setting screen, making settings easier to understand.)
Reduction in Inspection Process Debugging Time AI assists in automatic program generation. In addition to automatic generation from CAD data, AI automatically adjusts component libraries based on inspection results for certain components.
Accelerated Mass Production Preparation Simulation AI simulates the **cycle time and irradiation dose for each component and automatically sets X-ray inspection conditions. ※ Simulation is only available for some components.
| Industry Category | Electronic-Components-Supplies |
|---|---|
| Product Category | |
| Brand: | 鉴龙电子 |
| Spec: | VT-X750 |
| Stock: | 90 |
| Manufacturer: | |
| Origin: | China / Shanghai / Xingqu |