i-Cube10 Hybrid Mounting Equipment YRH10

Our company is the domestic agent for the new YAMAHA Yamaha SMT placement machines. We have been dedicated to the SMT electronic equipment industry for many years, providing complete SMT line solutions and technical support to nearly a thousand customers. In addition to supplying YAMAHA placement machines, we also offer cost-saving solutions within the complete line setup to enhance customer production efficiency and foster mutual growth and progress.

To meet the evolving demands of electronic assembly for higher precision, efficiency, and integration, and adhering to the philosophy of providing suitable electronic assembly "solutions," we have introduced the new generation of intelligent, modular placement equipment—the YS series placement machines. These have been widely acclaimed by customers. New and existing clients are welcome to inquire and discuss. Contact: Miss Ma at 15013642206

Product Name: Flip Chip & Wafer & SMD Hybrid Placement Machine, Flip Chip Placement Machine YRH10, i-Cube10 Hybrid Placement Equipment YRH10

Model: i-Cube 10 (YRH10) Placement Machine
Brand: YAMAHA
Origin: Japan

Product Features: i-Cube10 (YRH10)---A hybrid placement equipment independently developed by Yamaha, suitable for module product production and capable of mixed placement of semiconductor components and SMD components.

Hybrid Placement Equipment --- i-Cube10 (YRH10)

● Mixed Installation: Achieves mixed placement of semiconductor components and SMD components

● High Speed/High Precision Placement: ±15μm (Cpk≧1.0)

10,800 CPH (with wafer feeding) Note: Based on our company's conditions

● Improved Component Feeding: Supports electric feeders

● Supports Large Substrates: L330 x W250mm

Product Introduction:

Mixed Placement of Semiconductor and SMD Components

Capable of handling various feeding forms and placement processes, this single machine can achieve substrate placement for both semiconductor and SMD components. Additionally, it comes standard with post-placement inspection functionality.

1. Feeding Forms

● Component Feeder (Customized)

● Flux Dipping Process

● Tape Reel Feeding

● Wafer Feeding (Standard)

● Solder Reel Feeding (Customized)

● Waffle Tray Feeding (Customized)

2. Adhesive Dipping Nozzle (Optional)

Example of Module Component Manufacturing Process

3. Various Trays Available

● Wafer Tray (Standard)

● Waffle Tray (Customized)

II. High Speed/High Precision Placement

Improved placement accuracy, which is critically important in semiconductor component placement.

Additionally, by increasing the number of nozzles on the placement head to 10, high productivity is achieved while maintaining placement accuracy.

1. In-Line Placement Head with Scanning Camera

A high-speed universal placement head capable of handling everything from micro components to medium-sized and irregularly shaped components.

The use of a scanning camera allows for shorter distances from pickup to placement, resulting in higher productivity.

2. Multi-Accuracy Correction System "MACS"

Achieves placement accuracy of ±15µm (µ+3σ) through Yamaha's independently developed Multi-Accuracy Correction System.

III. Support for Electric Feeders and Ample Optional Features

Supports electric feeders, improving pickup accuracy for tape-fed components. Combined with the Multi-Accuracy Correction System "MACS," it enables high-precision component pickup and placement.

● ZS Feeder

This equipment supports electric intelligent feeders (SS/ZS/ZSR) compatible with placement machines. The use of these compact and lightweight feeders improves operational efficiency and reduces the workload for operators.

● Auto-Replenishment Feeder

Also compatible with auto-replenishment feeders that can pre-load two reels. Eliminates the need for tape splicing and allows for distributed timing of component feeding, significantly reducing productivity loss due to component depletion.

● Various Optional Features

Includes nozzle stations, exhaust stations, and other optional features suitable for various applications.

IV. Compatibility with Various Production Processes

Customizable layout structures to match different production products.

Enhances both versatility and production efficiency, contributing to the realization of highly efficient production processes.

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