Semiconductor Flip Chip Hybrid Mounter YRH10

Our company is the domestic agent for the new YAMAHA Yamaha placement machines, dedicated to the SMT electronic equipment industry for many years. We have provided SMT entire line solutions and technical support to nearly a thousand customers. The company not only supplies YAMAHA placement machine equipment but also offers cost-saving solutions within the entire line setup to enhance customer production efficiency and grow together with our clients.

To meet the electronic assembly industry's demand for higher precision, efficiency, and integration, based on the concept of providing suitable electronic assembly "solutions" for customers, we have launched the new generation of intelligent, modular placement equipment—the YS series placement machines, which have been widely recognized and praised by customers. New and existing clients are welcome to call for consultation and discussion. Miss Ma: 15013642206

Product Name: Flip Chip & Wafer & SMD Hybrid Placement Machine;Semiconductor Flip Chip Hybrid Placement Machine YRH10

Product Model: i-Cube 10 (YRH10) Placement Machine

Product Brand: YAMAHA

Place of Origin: Japan

Product Features: i-Cube10 (YRH10)---A hybrid placement device independently developed by Yamaha, suitable for module product production, capable of mixed placement of semiconductor components and SMD components.

Hybrid Placement Device ---  i-Cube10 (YRH10)

● Hybrid Installation:Achieves mixed placement of semiconductor components and SMD components

● High-Speed/High-Precision Placement:±15μm(Cpk≧1.0)

10,800 CPH (with wafer feeding) Note: Based on our company's conditions

● Improved Component Feeding:Supports electric feeders

● Supports Large Substrates:L330 x W250mm

Product Introduction:

Mixed Placement of Semiconductor Components and SMD Components

Capable of handling various feeding forms and placement processes, a single device can achieve substrate placement for both semiconductor and SMD components. Additionally, it comes standard with post-placement inspection functionality.

1. Feeding Forms

● Component Feeder (Custom)

● Flux Dipping Process

● Tape Reel Feeding

● Wafer Feeding (Standard)

● Solder Reel Feeding (Custom)

● Waffle Tray Feeding (Custom)

2. Flux Dipping Nozzle (Optional)

Example of module component manufacturing process

3. Equipped with Various Trays

● Wafer Tray (Standard)

● Waffle Tray (Custom)

II. High-Speed/High-Precision Placement

Improved placement accuracy, which is particularly emphasized in semiconductor component placement.

Moreover, by increasing the number of nozzles on the placement head to 10, high productivity is achieved while maintaining placement accuracy.

1. In-Line Placement Head with Scanning Camera

A high-speed universal placement head capable of handling everything from micro components to medium-sized/irregular components.

By adopting a scanning camera, the action from pickup to placement is completed over a shorter distance, achieving higher productivity.

2. Multi-Accuracy Calibration System "MACS"

By employing Yamaha's independently developed multi-accuracy calibration system, placement accuracy of ±15µm (µ+3σ) is achieved.

III. Supports Electric Feeders and Comes with Ample Options

Supports electric feeders, improving pickup accuracy for tape-fed components. Combined with the Multi-Accuracy Calibration System "MACS," high-precision component pickup and placement are achieved.

● ZS Feeder

This device supports electric smart feeders (SS/ZS/ZSR) that are compatible with placement machines. Using these small, lightweight feeders improves operational efficiency and reduces the workload for operators.

● Auto-Replenishment Feeder

Also compatible with auto-replenishment feeders that can pre-load two reels. Eliminates the need for tape splicing and allows for分散处理 of component feeding timing, significantly reducing productivity loss due to component depletion.

● Various Options

Equipped with options such as nozzle stations and exhaust stations suitable for various applications.

IV. Capable of Handling Various Production Processes

Customizable layout structures tailored to different production products.

Enhances both versatility and production efficiency, contributing to the realization of highly efficient production processes.

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