DALOC-4212 Epoxy Adhesive

DALOC 4212 Epoxy Adhesive: This product is suitable for bonding various materials. It offers excellent electrical insulation, resistance to solvents and chemicals, and extremely high structural strength after curing. With superior bonding density, it can be cured at high temperatures, making it an advanced insulating and fixing material. It can bond a very wide range of materials.  Applications include relay bonding and sealing, potting and bonding of electronic components, packaging of bonded ICs, bonding and sealing of sensors, and crafts. There is also a potting and gap-filling type available. Feel free to call for purchase. This product is suitable for bonding various materials. It offers excellent electrical insulation, resistance to solvents and chemicals, and extremely high structural strength after curing. With superior bonding density, it can be cured at high temperatures, making it an advanced insulating and fixing material. It can bond a very wide range of materials.  Applications include relay bonding and sealing, potting and bonding of electronic components, packaging of bonded ICs, bonding and sealing of sensors, and crafts. There is also a potting and gap-filling type available. Feel free to call for purchase. This product is suitable for bonding various materials. It offers excellent electrical insulation, resistance to solvents and chemicals, and extremely high structural strength after curing. With superior bonding density, it can be cured at high temperatures, making it an advanced insulating and fixing material. It can bond a very wide range of materials.  Applications include relay bonding and sealing, potting and bonding of electronic components, packaging of bonded ICs, bonding and sealing of sensors, and crafts. There is also a potting and gap-filling type available. Feel free to call for purchase. This product is suitable for bonding various materials. It offers excellent electrical insulation, resistance to solvents and chemicals, and extremely high structural strength after curing. With superior bonding density, it can be cured at high temperatures, making it an advanced insulating and fixing material. It can bond a very wide range of materials.  Applications include relay bonding and sealing, potting and bonding of electronic components, packaging of bonded ICs, bonding and sealing of sensors, and crafts. There is also a potting and gap-filling type available. Feel free to call for purchase.