Nordson Asymtek S2-900 Dispensing Machine

Nordson Spectrum II Premier S2-900 Dispensing System

To meet the evolving cutting-edge dispensing applications, the Spectrum™ II Premier, equipped with the IntelliJet® jetting system, offers advanced technologies in closed-loop process control, vision alignment, and jet dispensing.

• The Spectrum II Premier platform provides high reliability, quality, and process control for complex dispensing applications in semiconductor and mobile electronics packaging.

• Pre-configured with the IntelliJet system, it is the ideal jetting valve for dispensing the smallest dots and lines with set frequency and minimal maintenance operations.

• The integrated Monocle™ monolithic lens vision package locates multiple dispensing positions through scalable high-resolution field of view and 5-channel independent light source control.

• Key features, such as Fids-on-the-Fly™ and wafer programming software, non-contact laser height sensor, and substrate heating, are standard in the Premier system.

• The Premier is designed for current and future cutting-edge applications, such as wafer-level packaging, advanced camera modules, and underfill dispensing for high-density printed circuit boards, delivering higher throughput.

Nordson ASYMTEK's Spectrum II Premier system is based on the widely popular Spectrum II platform. The Spectrum II Premier with the IntelliJet jetting system is suitable for dispensing small dots in advanced packaging applications, ensuring accuracy in dense dispensing volumes and controlled by Nordson ASYMTEK's patented automated process-calibrated jetting technology. High-frequency jetting enables faster line speeds to increase output and meet the demands of next-generation semiconductor packaging for advanced dispensing performance, such as wafer-level packaging, advanced camera modules, and underfill dispensing for high-density printed circuit boards. The Spectrum II Premier system comes standard with a monolithic lens vision package, enhancing the accuracy of fiducial search and alignment. Additionally, built-in software features significantly reduce programming time for complex dispensing patterns, such as multi-pass, non-linear wafer dispensing patterns.

Features

• Equipped with IntelliJet jetting system

• High-resolution monolithic vision package

• Fids-on-the-Fly software for high-speed fiducial recognition

• Non-contact laser height sensor

• Automated Process-Calibrated Jetting (CPJ) technology

• FluidMove® software

• Dual-valve synchronization and dual-valve dual-control dispensing – optional

• Dispensing at an angle: single-axis and programmable tilt + rotation – optional

• Dual-lane dispensing for increased throughput – optional

• Pre-/in-/post-dispensing heating to enhance underfill outflow and curing – optional

• MH-900 material handler – optional

• Multiple applications (underfill, cavity fill, die attach, precision coating, encapsulation, and more)