Bus alloy material fusible alloy

Low melting point alloys refer to fusible alloys with melting points below 232°C (the melting point of Sn), typically composed of low melting point metallic elements such as Bi, Sn, Pb, Cd, etc. These alloys are widely used as soldering materials and thermal-sensitive components like fuses and fusible links in electrical, steam, firefighting, and fire alarm systems. They represent a class of promising new materials with significant development potential.

Low melting point tin-bismuth mold alloys are used to manufacture cold stamping dies for thin sheets, capable of pressing copper, aluminum, steel, stainless steel, and other sheet metals, with steel sheet thickness up to a certain limit. They are applied for stretching, bending, and forming thin sheets. Using low melting point alloy molds eliminates the need for mold steel, simplifies and speeds up mold formation; reduces mold costs and allows for quick updates; requires no adjustment or machining of molds; and enables remelting and reuse of alloys after mold use. Due to rapid mold formation, storage space for molds can be significantly reduced.

Low melting point tin-bismuth alloy molds utilize low melting point non-ferrous metal alloys as casting materials, forming stamping dies based on master patterns within a melting box. In the late 20th century, these molds found applications, particularly demonstrating advantages in deep drawing molds for automotive panels.

Characteristics of low melting point tin-bismuth alloys: Stamping molds feature simultaneously formed convex and concave molds through casting, ensuring uniform clearance after casting without need for adjustment; molds can be cast directly on press machines and used immediately after casting; alloy materials for mold casting can be remelted repeatedly or repurposed for other molds. With economic development, tin-bismuth alloys are expected to embrace broader application prospects.