AiT Two-Component Flexible Stress-Free Epoxy Conductive Adhesive EG8050-LV

AiT Two-Component Flexible Stress-Free Epoxy Conductive Adhesive EG8050-LV

Product Features:

EG8050-LV is a silver-filled conductive epoxy with excellent flexibility when bonding materials with highly mismatched CTE values, such as alumina to aluminum or silicon to copper. It can be easily reworked at temperatures between 80-150°C, making it highly suitable for applications like large-area chip attachment and substrate bonding due to its ability to join materials with significant CTE mismatch.

Applications:

Large-size chip bonding

Substrate/component bonding

Bonding requiring reworkability

Bonding of mismatched CTE substrates

Alternative to solder

Usage Steps:

(1) Mix the adhesive at a 1:1 weight ratio. (Note: In the kit, the viscosity of Part A > the viscosity of Part B)

(2) Dispense the adhesive onto a clean substrate.

(3) Cure according to the recommended schedule.

Curing Schedule:

Temperature                 Time

25°C                120 hours

80°C                 8 hours

100°C                4 hours

125°C                2 hours

150°C               1 hour

AiT Two-Component Flexible Stress-Free Epoxy Conductive Adhesive EG8050-LV