Domestic EPO-TEK H20E chip packaging circuit assembly conductive silver adhesive

Case Name: Domestic EPO-TEK H20E Conductive Silver Adhesive for Chip Packaging and Circuit Assembly

Application Areas: Chip packaging, electronic and PCB circuit assembly, optoelectronic packaging, and other scenarios requiring electrical and thermal conductivity. Can replace imported EPO-TEK H20E.

Requirements:

The silver adhesive is solvent-free, 100% solid content, with low shrinkage and high-temperature resistance, capable of withstanding 300°C for short periods. Additionally, it features high thermal conductivity and high reliability.

Application Point Image:

Solution: Domestic 2010S Single-Component Conductive Silver Adhesive

2010S is a single-component epoxy silver adhesive using high-purity silver powder as the conductive medium. This conductive silver adhesive is solvent-free and 100% solid content, resulting in low shrinkage and high-temperature resistance, capable of withstanding 300°C for short periods. Additionally, it features high thermal conductivity and high reliability, making it suitable for chip packaging, electronic and PCB circuit assembly, optoelectronic packaging, and more.

Features

· Single-component

· High temperature resistance, capable of long-term service at 200°C

· 100% solid content, solvent-free

· Pot life of up to 65 hours

· Excellent bonding performance

· Low moisture absorption, high reliability

· Conductive properties

Semiconductor Integrated Circuit Packaging

Bonding chips to lead frames; compatible with silicon chips and MEMS chips, supports 260°C lead-free reflow soldering and meets JEDEC Level 1 packaging requirements.

Supports online rapid curing and traditional box oven processes.

Suitable for solderless flip-chip packaging and ultra-fine pitch SMD printing adhesives.

Hybrid Microelectronic Assembly

Comparable to solder and eutectic chip bonding in thermal performance; typically, thermal resistance differences do not exceed 1-2°C/W.

Bonding quartz crystal oscillators (QCO) to Au posts on TO can lead frames.

For microwave/radar applications with GaAs chips, frequencies up to 77GHz.

SMD adhesive that can cure simultaneously with chip bonding processes.

Compatible with Au, Ag, and Ag-Pd terminals of capacitor and resistor SMDs.

NASA-approved low-outgassing adhesive.

Adhesive for electromagnetic interference (EMI) and RF shielding in RF, microwave, and infrared devices.

Electronic and PCB Circuit Assembly

Used for electrical connections in acoustic applications such as speakers/microphones.

Electrical connection of piezoelectric elements to PCBs. PZT spacers connected to various circuits via H20E, including inkjet printheads, MEMS, and ultrasonic devices.

Automotive applications include pressure sensors and accelerometer circuits.

Conductive adhesive (ECA) for connecting circuits to copper coils in RF antenna applications (e.g., smart cards and RFID tags).    

ECA used to secure surface mount devices (SMDs) to flexible circuits of membrane switches. Compatible with silver-polytetrafluoroethylene (Ag-PTF) and carbon graphite PCB spacers. A low-temperature "solderless" solution.

Solar Photovoltaic Industry

ECA used for electrical connections between transparent conductive oxide (TCO) and PCB spacers.

Replaces solder joints for copper/tin ribbon interconnects between cells; a common "solar cell stringing" adhesive.

Bonding III-V semiconductor chips to substrates used in solar concentrator technologies, such as cadmium telluride (CdTe) and gallium arsenide (GaAs).

Effective heat sinks using materials like copper, beryllium oxide (BeO), and aluminum nitride on thermally conductive substrates.

Capable of high-yield dispensing via dot, array, and writing methods.

Optoelectronic Packaging Applications

Adhesive for fiber optic components in DIP, butterfly, or custom hybrid IC packaging. As an ECA, it bonds waveguides, chip-bonded laser diodes, and provides heat dissipation for high-power laser circuits.

Bonding infrared detector chips to PCBs or TO can headers.

Bonding LED chips to substrates using single-chip packaging or arrays.

Adheres to silver, gold, and copper-plated lead frames and PCBs.

In the LCD industry, electrical connection between ITO and PCBs.

Low-temperature ECA suitable for OLED displays and organic printable electronics.