Thermal Conductive Potting Compound for Power Modules as an Alternative to LORD SC-320LVH

Thermal Conductive Potting Compound for Power Modules as Replacement for LORD SC-320LVH

Case Name: Thermal Conductive Potting Compound for Power Modules (Replacement for LORD SC-320LVH)

Application Point: Thermal Conductive Potting for Power Modules 

Requirements:

1. Thermal conductivity greater than 2.5 W/m·K;

2. Good fluidity, viscosity around 4000 cps;

3. Replacement for LORD SC-320LVH

Application Point Image:

Solution: Two-component Silicone Thermal Conductive Potting Compound

Thermal Conductive Potting Compound for Power Modules as Replacement for LORD SC-320LVH