SE9184 Thermal Conductive Adhesive Sealant

SE9184 High Thermal Conductive Flame Retardant Silicone Sealant

Product Features: 1. Provides both bonding function and excellent thermal conductivity and heat dissipation.

2. Neutral curing, non-corrosive to most metals.

3. Exhibits excellent resistance to thermal cycling, aging, and electrical insulation properties.

4. The adhesive layer offers superior moisture resistance, shock resistance, corona resistance, and leakage current resistance.

5. Fully complies with EU ROHS directive requirements.

Type: One-component silicone rubber Physical Form: Viscous paste

Cures with moisture at room temperature, no oven required; solvent-free, no ventilation needed; short surface drying

time, which can improve online processing speed; curing can also be accelerated by

heating; does not flow after application; refined low volatility, reducing

volatiles that may affect surrounding components; UL94V-0 flame

retardancy rating.

Dow SE9184 Characteristics: Can be used to secure hybrid integrated circuit substrates, bond components with

heat sinks. Does not sag, slump, or detach from surfaces, with effective thermal conductivity.

Basic Uses: Dow SE9184 silicone thermal conductive material is an excellent protective

product. Its superior thermal conductivity largely depends on the good thermal interface between heat-generating devices and heat sinks. The surface tension of SE9184 silicone thermal conductive material is very low, allowing it to closely contact various interfaces, reducing

thermal resistance between interfaces.

Insulation, thermal conductivity. Dow CorningSE9184 provides excellent thermal conduction and heat transfer effects for heat-generating electronic components such as ICs, transistors, processors, etc. It is a rubber-like adhesive that combines both thermal conductivity and bonding

functions.

Typical Applications

Dow SE9184 can replace thermal grease for filling and bonding between CPUs and heat sinks, thyristor control

modules and heat sinks, high-power devices and heat sinks.

Using this adhesive can also eliminate the need for traditional connection methods such as clips and screws, making the process simple and convenient.