DIP Double-Sided Inspection AOI

New Generation Wave Soldering AOI Inspection Equipment — Dual-Side AOI with Top and Bottom Cameras. An AOI that requires no parameter setting, featuring powerful detection capability and low false alarm rate. Using two cameras (top and bottom) to capture images of the same board during movement, it employs deep neural network algorithms for one-click intelligent search, rapid programming, and intelligent judgment of component defects and solder joint defects. Provides real-time and practical statistical analysis data to quickly understand current quality and efficiency status.

Product Features:

● Utilizes convolutional neural networks, deep learning models, computer vision, and image processing to improve solder joint detection rate; inspects plug-in components and solder joints.
● Exceptional character and barcode recognition capability
● Detection rate up to 99.9%, reducing false alarm rate, truly enabling unattended operation of online AOI. Under the premise of ensuring the detection of genuine defects, the machine offers consistent measurement results and low misjudgment, effectively reducing manual labor.
● Intelligent algorithms and smart programming, low requirements for programmers, easy to learn, one-click assisted rapid programming;
● Fast detection speed, simultaneous inspection of both sides, automatically plans optimal path for movement and inspection, saving image capture time;
● Multiple detection modes, supports panel inspection, mixed board inspection, and mixed material inspection.
● SPC statistical analysis
● Traceability, supports integration with MES systems.

Inspection Examples:

1. Can inspect component errors, omissions, reversals, floating height, tilting, lifted leads, etc.
2. Detects SMT component issues such as missing parts, reversed orientation, misalignment, damage, tilting, extra parts, foreign objects, solder balls, etc.
3. Identifies solder joint defects including excess solder, insufficient solder, no solder, solder voids, solder bridges, cold joints, non-protruding leads, pinholes, missed soldering, etc.

Specifications

PCBA Size: min: 5mm x 5mm max: 510mm x 460mm
PCBA Thickness: 0.5mm - 6mm
Component Height: Top side: 150mm Bottom side: 40mm
Camera Resolution: Solder side: 5MP full color or 12MP full color; Component side: standard 20MP or optional 12MP, selected based on application environment
Light Source: Top white light + Bottom RGBWS four-color ring LED light
Pixel Size: 3.45μm (5MP full color); 2.45μm (20MP full color)
CPU: Intel i7 10th Gen 10700KF Graphics Memory: 8GB
RAM/Storage: 64GB DDR / 256GB SSD + 2TB HDD
Display: 22"/23.8" FHD Monitor
Motion Mechanism: Imported servo motor with lead screw
Conveyor Width Adjustment: Motorized
Operating System: Ubuntu 19.2 LTS 64-bit
Dimensions: L x W x H = 1060mm x 1340mm x 1500mm (excluding monitor stand and three-color lamp)