CMP Grinding Cooling Water Temperature Control and Constant Temperature Equipment

Chemical MechanicalCMPPolishingCooling Water Temperature Control Equipment

Product Introduction

1. In the field of semiconductor chip manufacturing, the surface treatment process of silicon wafers requires a flat surface during exposure to effectively avoid light scattering and achieve image transfer. Chemical Mechanical Polishing (CMP) is used to meet standard process requirements. As semiconductor chip manufacturing processes advance to the millimeter level, CMP is necessary to ensure the flatness of silicon wafer surfaces meets production standards.

2. The relative motion between the silicon wafer and the polishing pad generates friction, causing the temperature of the polishing pad to rise, potentially reaching 80°C. The optimal temperature range for the polishing pad is 30°C to 75°C. If the temperature falls below 30°C or exceeds 75°C, the chemical reaction characteristics between the polishing slurry and the silicon wafer surface deteriorate, affecting the flatness of the wafer surface. Therefore, a Chemical Mechanical CMP Polishing Cooling Water Temperature Control Equipment is required to regulate the water temperature.

3. The Chemical Mechanical CMP Polishing Cooling Water Temperature Control Equipment provides chilled water to cool the cooling device of the polishing belt in the CMP polisher, addressing the issue of high polishing belt temperatures during operation. The cooling system includes a chilled water tank and a water pump, with the chilled water tank in contact with the polishing surface of the polishing belt, effectively reducing the temperature of the polishing belt during operation.

Equipment Application

The cooling of the built-in cooling device in double-sided Chemical Mechanical CMP polishing of silicon wafers utilizes the cold source provided by the Chemical Mechanical CMP Polishing Cooling Water Temperature Control Equipment. The regulation system and display control system allow real-time monitoring of the working temperature via the display panel. The cooling water flows through the cooling channels to cool the lower polishing plate, effectively controlling the processing temperature of the silicon wafer, improving the surface quality of CMP polishing, and reducing the breakage rate of silicon wafers.

Product Advantages

As a temperature control system for Chemical Mechanical CMP polishing, the Chemical Mechanical CMP Polishing Cooling Water Temperature Control Equipment ensures the temperature of silicon wafers during polishing is controlled, maintaining ideal yield rates and extending the service life of the polishing process. It effectively enhances the flatness and stability of silicon wafers.

Product Features

Standard Model: Intelligent water temperature control from 5°C to 30°C ±1°C.

Customized Model: Intelligent water temperature control from -50°C to 85°C ±0.3°C; water flow control from 1 to 1000L ±0.03L; pressure control from 0.1 to 10 ±0.04Mpa.

Intelligent Control System: PLC, touch screen, data acquisition, RS485 interface, optional CAN communication bus, Ethernet interface for remote control, connectable to upper computer and mobile APP control.

Protection Functions: Power phase sequence protection, leakage protection, compressor overload protection, coil overheating protection, high and low pressure protection, water shortage protection, chilled water flow protection, and anti-freeze protection.

After-Sales Service

To build our brand and establish a strong corporate image, we adhere to the principle of "pursuing quality in all aspects and ensuring customer satisfaction." Based on the principles of "competitive pricing, comprehensive service, and reliable product quality," we make the following solemn commitments:

1. The buyer's user department can receive free equipment operation training at our company.

2. Three months after use, our customer service department will conduct a follow-up on the equipment's usage status.

3. All our equipment comes with a one-year free warranty. During the warranty period, all required spare parts and repairs are covered by our company. However, damage caused by improper use is not covered under warranty, and the buyer shall bear the costs of replacement parts, travel, and accommodation.

4. Free on-site debugging and technical guidance on usage based on customer requirements.

5. Beyond the free warranty period, the buyer shall bear the costs of replacement parts (priced at material procurement cost) in case of equipment damage.

6. We ensure the supply of equipment spare parts and can sign a lifetime maintenance service agreement, providing lifelong maintenance services for the product.

7. Upon receiving a customer call or an "Equipment Fault Notification," we will attempt remote maintenance. If the issue cannot be resolved remotely, we will arrive on-site within 24 hours for locations within Guangdong Province and within 72 hours for locations outside Guangdong Province.

Technical Parameters