
广州太吉新材料有限公司
广州太吉新材料有限公司
Main Products:Low-chlorine, high-purity, light-colored Triglycidyl p-Aminophenol (TGPAP) AFG-90/3102L/MY0510, Tri-glycidyl p-aminophenol XY530L, 80°C Low Temperature Curing Dicyandiamide Accelerator, Low Temperature Curing Latent Curing Agent TJ-UR301,
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Low-chlorine, high-purity, light-colored Triglycidyl p-Aminophenol (TGPAP) AFG-90/3102L/MY0510
Chemicals/Laboratory Reagents/Other Chemical Reagents¥ 1 /kg
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Tri-glycidyl p-aminophenol XY530L
Chemicals/Chemical Intermediates/Intermediate Compounds¥ 1 /kg
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80°C Low Temperature Curing Dicyandiamide Accelerator, Low Temperature Curing Latent Curing Agent TJ-UR301
Chemicals/Catalysts & Additives/Curing Agents¥ 1 /kg
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Electronic Grade Low Chlorine Bisphenol F Epoxy Resin YLE-1300F
Chemicals/Phenols/Hydroquinone¥ 1 /kg
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Pyromellitic dianhydride high-temperature epoxy resin curing agent
Chemicals/Plastics & Products/Plastic Raw Materials¥ 1 /kg
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PCB ink uses Taiwan Changchun o-cresol novolac epoxy resin CNE202.
Chemicals/Phenols/Hydroquinone¥ 1 /kg
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Inhibitor 510 Tris(N-nitroso-N-phenylhydroxylamine) aluminum salt NPAL
Chemicals/Amines/Cyclohexylamine¥ 1 /kg
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DOW DNE425 Low Viscosity Heat-Resistant Phenolic Epoxy Resin KOLON (KEP1131) Taiwan Nan Ya Changchun
Chemicals/Plastics & Products/Plastic Raw Materials¥ 1 /kg
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Diaminodiphenyl sulfone high-temperature resistant epoxy resin curing agent DDS
Chemicals/Plastics & Products/Plastic Raw Materials¥ 1 /kg
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Guangzhou Taiji New Materials Co., Ltd. is a specialized research and development supplier of specialty epoxy resins and curing agents. Its leading products include: environmentally friendly green IC electronic packaging (electronic molding compounds) materials for lead-free soldering and halogen-free flame retardancy, such as phenol aralkyl self-flame-retardant epoxy resins (XYLOK) for electronic circuit boards and photoresist inks (green oils), biphenyl self-flame-retardant BPN epoxy resins, DCPD cyclopentadiene-type high heat-resistant resins, SU8 resins, ortho-cresol novolac epoxy resins (ECN), high-purity colorless phenol novolac epoxy resins (PFN), and bisphenol A novolac epoxy resins (BPANE); specialty fused-ring low-moisture-absorption epoxy resins and their phenolic curing systems; specialty epoxy resins for encapsulation and casting molding of electronic components like LEDs, modified hydrogenated anhydride curing agents, and bicyclic amidine accelerators; specialty phenolic epoxy resins, flame-retardant epoxy resins, and their phenolic curing agents for heavy-duty anti-corrosion powder coatings for pipelines, anti-corrosion powder coatings for steel bars, low-temperature curing powder coatings for MDF boards, and electronic encapsulation insulating powder coatings.