DOW DNE425 Low Viscosity Heat-Resistant Phenolic Epoxy Resin KOLON (KEP1131) Taiwan Nan Ya Changchun

Low viscosity high temperature resistance, vinyl resin, copper clad laminate, plastic sealing material, insulation material, temperature resistant coating, low viscosity adhesive temperature resistant epoxy resin, PNE177, NPCN-638S, N680, 2815 Korea Colon low viscosity phenolic epoxy resin (KEP1131) US Huntsman EPN1179 US Dow DNE425

Chinese name: Phenolic epoxy resin
Chinese alias: Phenolic epoxy resin; Formaldehyde with (chloromethyl)oxirane and phenol polymer; Epoxy resin (Type 644)
CAS No: 9003-36-5
EINECS number: 500-006-8
Molecular formula: (C₆H₆O?C₃H₅ClO?CH₂O)_x
Boiling point: 181.8°C at 760 mmHg
Flash point: 72.5°C
Density: g/cm³
Safety instructions: Moderately toxic by ingestion and skin contact. A mild skin irritant. When heated to decomposition it emits toxic vapors of Cl?.

Main product catalog

Special functional epoxy resins applied in green electronic encapsulation, IC packaging, and circuit boards with high heat resistance, low moisture absorption, and low thermal expansion coefficient

DNE260 Dicyclopentadiene phenol type epoxy resin---

Aralkyl phenol type self-extinguishing epoxy resin-

Biphenyl phenol type self-extinguishing epoxy resin--

Fused ring naphthalene type epoxy resin---

Trifunctional epoxy resin---

High purity series o-cresol formaldehyde epoxy resin---

High purity light color phenol formaldehyde epoxy resin----

Bisphenol A type phenolic epoxy resin----

0  Thick film photoresist special resin---

Brominated flame retardant epoxy resin-------

Brominated phenol formaldehyde epoxy resin--------

Biphenyl crystalline epoxy resin  -------

Phenolic curing agents with high heat resistance, low moisture absorption, and low thermal expansion coefficient

Xylock aralkyl phenol curing agent-----

Biphenyl phenol type curing agent--------------

Bisphenol A formaldehyde type curing agent-----------

Phenol formaldehyde type curing agent-----------

o-Cresol formaldehyde type curing agent-------------

Special epoxies applied in electronic insulation encapsulation, pipeline anti-corrosion powder, rebar anti-corrosion powder, MDF board and other powder coating fields

High purity series o-cresol formaldehyde epoxy resin

Chinese name: 2-Ethyl-4-methylimidazole
Chinese alias: 4-Methyl-2-ethylimidazole
CAS No: 931-36-2
EINECS number: 213-234-5
Molecular formula: C6H10N2
Boiling point: 292-295°C
Flash point: 155°C
Refractive index: 1.499-1.503
Density: 0.975
Appearance: Pale yellow thick fluid
Use: Used for epoxy resin bonding, coating, casting, encapsulation, impregnation, and composite materials.