80°C Low Temperature Curing Dicyandiamide Accelerator, Low Temperature Curing Latent Curing Agent TJ-UR301

I. Composition and Characteristics:

A urea-based compound, halogen-free. It appears as a white powder at room temperature with an average particle size of less than 5 μm, exhibiting good compatibility with epoxy resin. When used in combination with dicyandiamide and hydrazides, it effectively reduces the curing temperature of dicyandiamide and hydrazides. After mixing with epoxy resin, it provides a long pot life (1-3 months at room temperature), and the system cures within 30-60 minutes at 110-120°C. It serves as a latent mid-temperature accelerator for epoxy resin. TJ-UR301 can also be used alone as a curing agent.

II. Technical Parameters:

III. Usage:

1. Recommended Dosage: 128 (Nanya): DICY: TJ-UR301 = 100:5:2.5

2. Adhesive Preparation: When preparing the adhesive, first heat the epoxy resin to no more than 80°C, then add the curing agent and disperse it uniformly. Subsequently, add the TJ-UR101 accelerator and ensure thorough dispersion within the resin system. The mixing time after adding TJ-UR301 should be less than 30 minutes. Then, quickly cool the mixture and store it for later use.

3. Pot Life: The prepared adhesive can last 1-3 months at room temperature and up to 6 months when stored at 5°C.

4. Factors such as mixing temperature, time, and dosage can affect the pot life.

IV. Applications:

Used in epoxy resin prepregs, one-component epoxy adhesives, epoxy inks, and other fields.