Diglycidyl Hexahydrophthalate

Product Name: Diglycidyl Hexahydrophthalate

English Name:Diglycidyl 1,2-Cyclohexanedicarboxylate

Japanese Name:1,2-Cyclohexanedicarboxylic Acid Diglycidyl Ester

Korean Name:1,2- 사이클로헥산다이카복실산 다이글리시딜 에스터

Russian Name: Diglycidyl1,2-cyclohexanedicarboxylate

CAS Number:5493-45-8

Structural Formula: Molecular FormulaC14H20O6; Molecular Weight:284.31  Refractive Index:1.487

Product Grades: S182/TTA182/CY183/ 711/ EP-3520/Epikote E-190(Resolution)/S-540

Product Grades: S184, CY184  TTA184, EPOX MK R540

Product Description: This alicyclic epoxy resin features a saturated structure with excellent weather resistance, preventing cracking or yellowing in finished products. During electrical decomposition, it produces carbon dioxide and water instead of graphite (which causes short circuits in aromatic resins). The cured product exhibits high crosslinking density, good toughness, excellent UV and arc resistance, and thermal stability. Martin heat resistance: 82-108°C, tensile strength: 75.5-83.7 MPa, flexural strength: 147-170 MPa.

Low viscosity and good fluidity allow reduced or eliminated use of organic solvents during processing. With low chlorine content, it is particularly suitable for insulating materials requiring high electrical performance. It offers high-temperature insulation, strong arc resistance, and tracking resistance. It can be heat-cured or UV-cured, with fast curing speed and low shrinkage. The cured product has high crosslinking density and Tg  >200°C. Main applications include LED encapsulation, insulating potting, mold casting, metal surface bonding, adhesives, composites, UV-curable inks, and coatings.

Technical Specifications:

Item	Specification
Appearance	Colorless transparent viscous liquid
Color (APHA)	≤100
Viscosity (25°C)	600-900 mPa·s
Epoxy Equivalent Weight	160-180
Moisture Content (%)	≤0.2

Applications: Primarily used in coatings, composites, adhesives, and the electronics industry. It offers good heat resistance, weather resistance, electrical insulation, and low viscosity. Main applications include fiber-reinforced composites, electronic component potting, coatings, LED encapsulation, epoxy reactive diluents, optical adhesives and UV-curable products, large power molds, stabilizers, etc.

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