Die Bonder Die Attach Machine (cecjc)

Introduction:

TRESKY's die bonders are well-suited to provide excellent solutions for the optoelectronics industry. They offer application flexibility, including epoxy die attach, eutectic die attach, flip chip, and UV curing solutions. TRESKY provides assembly solutions for laser diodes, lens assemblies, disk drive slider assemblies, fiber optic components, and MEMS applications.

Ningbo Zhongdian Jichuang Technology is a company with multiple patents and production capabilities in micro-assembly production lines. Its main products, such as automatic chip lead forming machines, ultra-depth-of-field digital microscopes, semi-rigid cable bending and forming machines, and the TR-50S chip lead forming machine, have been well-received in the market. Continuous investment in research enables the company to drive innovation across the entire micro-assembly industry.