High Vacuum Multi-Target Magnetron Sputtering Coating Machine

MS-450 High Vacuum Multi-Target Magnetron Sputtering Coating Machine

Vacuum Chamber: Diameter 450✕H400mm, made of high-quality 1Cr18Ni9Ti stainless steel, argon arc welded, front-opening door structure;

Vacuum System: Mechanical pump + molecular pump (imported and domestic options available);

Ultimate Vacuum: Better than 5✕10⁻⁵Pa (after baking and degassing);

Vacuum Pumping Speed: Atmosphere to 8✕10⁻⁴Pa ≤ 30 minutes;

Lifting Substrate Stage: 2～6 inch substrate stage, target-to-substrate distance 60～120mm continuously adjustable online automatically, rotation speed 0～20r/min adjustable, heatable up to 500℃ (water cooling function optional), optional bias cleaning function;

Magnetron Targets: 2～4 pieces of 3-inch diameter targets (can be upgraded to 2～3 pieces of 4-inch diameter targets), compatible with DC and RF, capable of sputtering magnetic materials;

Sputtering Power Supply: DC pulse sputtering power supply, fully automatic matching RF sputtering power supply optional;

Mass Flow Controller: 2～3 channels of process gas, can be increased according to process requirements;

Thickness Monitor: Optional domestic or imported single water-cooled probe thickness monitor;

Control Method: PLC + touch screen control system, with air leakage self-check and prompt, communication failure, achieving one-button vacuum pumping and stopping.