Vigortech Semiconductor Wafer Cassette Ultrasonic Cleaning Machine

Semiconductor Wafer Cassette Ultrasonic Cleaning Machine VGT-507FH

In semiconductor manufacturing processes, the wafer cassette, as the core container for carrying and transporting wafers, has a cleanliness level that directly impacts wafer yield and process stability. With repeated use, cassettes accumulate contaminants such as particles, organic residues, and metal impurities. Traditional cleaning methods struggle to thoroughly remove nanoscale residues from micropores and narrow gaps. The VGT-507FH Ultrasonic Cleaning Machine, with its innovative technology, is becoming a key solution to this industry challenge.

Importance of Ultrasonic Cleaning Technology in the Semiconductor Field:

Semiconductor manufacturing demands near-perfect cleanliness. Residual particles on cassette surfaces can cause chip circuit short circuits, while metal ion contamination can alter the electrical properties of semiconductor materials. As process nodes advance below 5 nanometers, cassettes must achieve >99% removal of sub-micron particles (<10nm) and metal contaminants, with metal contamination levels below 1×10⁸ cm⁻².

Ultrasonic cleaning utilizes cavitation effects for non-contact cleaning: high-frequency ultrasound generates microbubbles in the cleaning solution that implode instantaneously, creating micro-jets with pressures exceeding 1000 atmospheres. These jets penetrate complex geometric structures of cassettes (such as slots and hinge gaps) to dislodge stubborn contaminants. Compared to high-pressure spraying or chemical immersion, this technology significantly reduces the risk of damage, making it particularly suitable for precision components.

The VGT-507FH series takes this further with dual-frequency ultrasonic synergy (e.g., 40kHz and 68kHz combination), enabling the removal of both larger particles and nanoscale residues, adapting to various contamination scenarios.

Cleaning Process and Core Technologies of VGT-507FH:

Multi-stage agitation cleaning:

The agitation mechanism, driven by an eccentric wheel, moves the linear slider to ensure the cassette moves up and down uniformly in the tank, enhancing liquid friction. It offers stable operation, low noise, and prevents system damage from overweight workpieces.

Intelligent fluid management:

The liquid storage tank uses partitioned chambers for self-circulation of cleaning solution, with separated oil and contaminants discharged into the main pipeline. It includes cooling water pipes and a liquid level alarm system to ensure process stability.

Efficient drying technology:

Features a "water removal followed by drying" design: high-pressure airflow in the air knife stage strips surface water droplets; the hot air drying tank evenly distributes filtered hot air via stainless steel ducts. The top movable tank lid moves with the bracket, ensuring excellent sealing.

Multifunctional Expansion and Industrial-Grade Design:

Although initially designed for coating ring cleaning, the VGT-507FH's technical features can be seamlessly applied to wafer cassette cleaning:

Modular compatibility:

The equipment supports integration of acid washing, alkaline washing, or ultra-pure water rinsing modules, meeting the needs of various chemical agents (e.g., DHF, SC-1 solution) in semiconductor cleaning.

Industry 4.0 adaptation:

Optional touchscreen systems and automated robotic arms enable unmanned operation. The PLC system monitors parameters like temperature and concentration in real-time to ensure process consistency.

Environmental and Economic Benefits:

A循环循环过滤系统 (0.1μm filter) reduces consumption of ultra-pure water and chemical solvents; the enclosed chamber design prevents evaporation, lowering waste liquid treatment costs.

Semiconductor manufacturing is essentially about controlling "dust" in the microscopic world, and the wafer cassette, as the "cradle" of wafers, has cleanliness as the first line of defense in the yield battle. The VGT-507FH combines cavitation effects with precision electromechanical control to build a dynamic cleaning fortress on this microscopic battlefield. In the future, as cleaning processes deepen integration with smart manufacturing, such equipment will not only remove physical contaminants but may also become a "cleaning node" in the data flow of semiconductor factories—eliminating pollutants while simultaneously purging anomalies in production parameters, ultimately achieving a leap from physical cleanliness to digital cleanliness.