IGBT Module 5SNG 0600R120500

Hitachi Energy's SPT (Soft Punch Through) chipset and its lower-loss improved versions (SPT+ and SPT++) are available for 1200 V and 1700 V respectively. Due to the moderate shrinkage of the chips, they feature the highest chip area per rated current output power. In addition to these mature planar chip technologies, starting from 2022, Hitachi Energy will also introduce a new chipset based on the recently developed Trench Fine Pattern (TFP) technology.

Typical applications for 1200 V include industrial drives, solar power, battery backup systems (UPS), and electric vehicles. Applications for 1700 V also encompass industrial power conversion and drives, wind turbines, and traction converters.

Hitachi Energy is expanding its successful range of IGBT modules into the medium-power sector. Beginning with the 62Pak and LoPak1, Hitachi Energy offers the high quality and reliability of HiPak modules.

Hitachi Energy's 62Pak modules utilize advanced packaging technology, fully leveraging the performance of the latest silicon technology:

1700 V SPT++ fast-switching IGBT/diode chipset with the lowest switching losses

Full 175°C operating temperature, complete square SOA

Excellent temperature cycling performance with wire-bonded chip connections

Standard packaging allows for temporary replacements