Usage Instructions

1. For sealing electronic products, use volatile organic solvents such as industrial alcohol to clean the surface of the workpiece, removing dirt and oil stains;

2. Curing should be performed using a UV lamp of appropriate wavelength. Irradiation should proceed from the center of the workpiece outward, ensuring that UV light penetrates to the bonding area. The bonded parts must not shift during operation; the use of fixing tools is recommended;

3. It is recommended that the wavelength of the UV light emitted by the curing equipment be between 365-400 nm, with an irradiation intensity of >10 mW/cm²;

4. UV light sources can be generated by carbon arc lamps, ultra-high-pressure mercury lamps, metal halide lamps, fluorescent lamps, and xenon lamps;

5. The curing speed is determined by the power of the UV light source, the wavelength of the emitted UV light, the distance of irradiation, the depth of radiation penetration, and the light transmittance of the transparent materials;

6. If surface glue needs to be dried, arsenic-mercury UV lamps are recommended;

7. When bonding heat-sensitive materials, pay attention to cooling to prevent thermal deformation;

8. UV-curing adhesives must be stored away from light, kept dry and clean, and stored at a temperature of approximately 10-26°C.