Submicron nickel powder, atomized spherical nickel powder, conductive nickel powder, flake reduced nickel powder, Ni.

Nano Nickel Powder Submicron Nickel Powder Atomized Spherical Nickel Powder Conductive Nickel Powder Flake Reduced Nickel Powder Ni

nickel atom

CAS: 7440-02-0

Technical Parameters

Product Performance

The high-purity nickel powder produced by our company integrates the advantages of electrolytic nickel powder, reduced nickel powder, and atomized nickel powder. Its main features are as follows:

1. High purity, nickel content not less than 99.9%;

2. Low content of elements such as carbon, phosphorus, sulfur, and oxygen;

3. Controllable particle size and bulk density;

4. Good powder compressibility and flowability.

Potential Application Areas:

1. Magnetic fluids: Iron, cobalt, nickel, and their alloy powders produce magnetic fluids with excellent performance, applicable in sealing, shock absorption, sound adjustment, optical display, and other fields;

2. Effective catalyst: Due to high surface activity, nano nickel powder has good catalytic effects;

3. Effective combustion promoter: Adding nano nickel powder to solid fuel propellants can significantly increase the combustion speed and heat of the fuel, ensuring good combustion stability;

4. Conductive paste: Electronic pastes are widely used in wiring, packaging, and connections in the microelectronics industry, playing an important role in the miniaturization of microelectronic devices. Electronic pastes made from nickel, copper, aluminum, and silver nanopowders are beneficial for further miniaturization of circuits;

5. High-performance electrode materials: Using nano nickel powder with appropriate processes can create electrodes with a large surface area, significantly improving discharge efficiency;

6. Activated sintering additive: Due to their large surface area and high proportion of surface atoms, nanopowders have high energy states and strong sintering capabilities at lower temperatures, making them effective sintering additives that can significantly reduce the sintering temperature of powder metallurgy products and high-temperature ceramic products;

7. Surface conductive coating treatment for metals and non-metals: Due to the highly activated surfaces of nano aluminum, copper, and nickel, coatings can be applied at temperatures below the melting point of the powder under oxygen-free conditions. This technology can be applied in the production of microelectronic devices.

Packaging and Storage

This product is packaged in vacuum-sealed multi-layer bags by default, with additional paper drums or cartons. After receipt, it should be stored sealed in a dry, cool environment. Prolonged exposure to air should be avoided to prevent moisture-induced agglomeration, which may affect dispersion performance and usage effectiveness.