VIGON® A 201 Cleaning Solution

VIGON® A 201
Water-based flux cleaning solution for spray cleaning processes
Flux cleaner
VIGON® A 201 is a water-based cleaning solution specifically developed for spray cleaning processes, effectively removing flux residues from fine gaps, such as in applications with low clearance under components. Without the need for any additives, VIGON® A 201 still ensures that solder joints remain bright after cleaning. Additionally, VIGON® A 201 is also recommended for flux cleaning processes in devices such as flip chips, CMOS, and power LEDs.

Advantages compared to other cleaning solutions:

VIGON® A 201 effectively removes flux residues in low-clearance areas
VIGON® A 201 is particularly suitable for removing flux residues from lead-free no-clean solder paste
The high cleaning load capacity of VIGON® A 201 ensures a long service life, thereby reducing cleaning costs
VIGON® A 201 is easy to rinse, leaving no residues on the cleaned surfaces or cleaning equipment
VIGON® A 201 effectively removes sticky flux residues on flip chips and CMOS devices, ensuring no bubbles in subsequent underfill processes
After chip soldering, the flux cleaning process with VIGON® A 201 improves the quality of subsequent wire bonding, giving power LED devices higher light conversion efficiency and longer service life
Application areas
Contaminant removal
Cleaning processes
Cleaning technology
Low-clearance cleaning
PCBA cleaning
Power electronic device cleaning
Packaged device cleaning