3D X-RAY Online Inspection Equipment Vitrox V810

Since its establishment in 2016, Shenzhen Yingsaite Automation Equipment Co., Ltd. has been professionally dedicated to the sales and service of DIP automation equipment, SMT inspection equipment, and semiconductor equipment for the electronics manufacturing industry. The company focuses on becoming an excellent provider of DIP automation equipment, SMT inspection equipment, semiconductor inspection equipment, and quality control solutions, offering one-stop solutions to customers. Its products include top-tier equipment from renowned international brands.

Authorized Distributor of ViTrox 3D AOI/AXI in China

3D V510 Online Optical Inspection System

3D V810 Online X-RAY Inspection System

Website:www.szyingsaite.com

Contact Number: 13924661275

Welcome to inquire!!!

Vitrox 3D AXI has consistently been the fastest equipment in the 3D online X-RAY industry in terms of production capacity—bar none. The latest S3 model has been tested to achieve a 30% increase in speed compared to previous versions, along with a qualitative improvement in performance. With the advent of global AI intelligence, Vitrox, as an industry leader, has pioneered AI automatic programming and automatic re-judgment. It enables real-time monitoring of key components such as X-ray tubes and camera cards, making the equipment more intelligent and ready for Industry 4.0 in 2025.

Vitrox V810 can detect various defects, including short circuits, open circuits, missing components, non-wetting, misaligned components, tombstoning, lifted leads, solder balls, voids, insufficient solder, reversed polarity of tantalum capacitors, and excess solder. Additionally, it can identify some of the most hidden solder joint defects commonly encountered in production, such as head-in-pillow (HIP), package-on-package (PoP), plated through-hole (PTH), and various types of connector joint defects. Its detection performance far surpasses other AXI equipment on the market. The test development environment features a user interface: a Microsoft Windows-based software solution with a simple user interface and user-level password protection.

New technology, simplified programming, and dedicated PoP key areas reduce the setup time for PoP slice height and improve the focusing accuracy for PoP inspection.
2. Intelligent initialization learning: Self-learning functionality reduces initial program setup time.
3. Component package database: A shared intelligent package database across all produced boards.
4. Second-generation slice imaging: Immediate viewing of different slice images in the defect analysis tool.
5. CAD creation: CAD documents can be created from PCBA inspection images or SMT placement machine data.
6. Patented composite auto-focus technology: Automatically focuses slices to the desired height without vertical movement of the X-ray tube or stage.
7. Solder profile feature map: Provides comprehensive systematic information for troubleshooting, Dynamic Range Optimization (DRO)
8. For components with very dark or uneven X-ray image darkness, high-definition images can still be obtained using the DRO function.
9. Enhanced image clarity: Multiple image enhancement techniques provide clear images for void detection and re-judgment of multi-layer components.
10. 3D CT imaging: Both the V810 machine and VVTS repair station can be equipped with 3D model inspection tools.
11. Image restoration function (PSF): Improves the clarity of 2.5D images to enhance test coverage for operators; void algorithm
12. Advanced algorithm with over 20 types of solder joint selections.
13. Phase Shift Profiling (PSP 2): Improves test accuracy and coverage for press-fit connectors and through-hole device boards.
14. New void algorithm: Enhances the precision of void detection for various component types, especially for pad components larger than 1 inch.
15. PTH inspection: The PTH inspection algorithm fully complies with IPC standards for through-hole solder wetting, and PTH pins can be sliced into 10 layers to determine solder wetting height.
16. BGA: Adds three slice layers (totaling six) for BGA solder balls, improving the detection rate of HIP defects.
17. Broken pin algorithm: Detects broken pins in PTH and surrounding areas.
18. Easy re-judgment
ViTrox Verification Tool Solution (VVTS)
ViTrox Verification Tool Solution (VVTS)
A clear and straightforward defect verification tool makes it easier for operators to make accurate judgments.
Images from 14 angle cameras
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19. Automatic defect judgment: Defective solder joints can be automatically judged as faulty without operator re-judgment.
20. Provides reference images of good products: Effectively improves the accuracy of operator re-judgment.
21. Image diagnosis: Highlights void areas and void area percentage.
22. PTH and BGA 2.5D images: Offers the industry's richest variety of angle images; integrated super server, speed improved
23. Real-time calculation of precise slice height (PSH): The new PSH function reduces inspection time compared to the previous PSH.
24. Single-core management: Improves hardware utilization and optimizes the efficiency of multi-core processors.
25. Intelligent optimized scanning path: Optimizes the scanning path by intelligently avoiding component-free areas.
26. Image Reconstruction Processor (IRP): A more powerful computing system reduces image reconstruction processing time.