Vitrox 3D X-RAY Inspection Equipment

Since its establishment in 2016, Shenzhen Yingsaite Automation Equipment Co., Ltd. has been professionally dedicated to the sales and service of DIP automation equipment, SMT inspection equipment, and semiconductor equipment in the electronics manufacturing industry. The company focuses on becoming an excellent provider of DIP automation equipment, SMT inspection equipment, semiconductor inspection equipment, and quality control solutions, offering one-stop solutions to customers. Its products include top-tier equipment from renowned international brands.

Authorized Distributor of ViTrox 3D AOI/AXI in China

3D V510 Online Optical Inspection System

3D V810 Online X-RAY Inspection System

Website:www.szyingsaite.com

Contact Number: 13924661275

Welcome to inquire!!!

ViTrox V810 can detect various defects, including short circuits, open circuits, missing components, non-wetting, misaligned components, tombstoning, lifted leads, solder balls, voids, insufficient solder, reversed polarity of tantalum capacitors, and excess solder. Additionally, it can identify some of the most hidden solder joint defects commonly encountered in production, such as head-in-pillow (HIP) defects, package-on-package (PoP) issues, plated through-hole (PTH) defects, and various types of connector joint defects. Its detection performance far surpasses other AXI equipment on the market. Test development environment user interface: Utilizes Microsoft Windows-based software solutions with a simple user interface and user-level password protection.

New technology, simplified programming, and dedicated PoP focus areas reduce the setup time for PoP slice height and improve the focusing accuracy for PoP inspection.
2. Intelligent initialization learning: Self-learning functionality reduces initial program setup time.
3. Component package database: Shares an intelligent package database across all production boards.
4. Second-generation slice imaging: Allows immediate viewing of images from different slices in the defect analysis tool.
5. CAD creation: CAD documents can be created using images from PCBA inspection or data from SMT placement machines.
6. Patented composite auto-focus technology: Automatically focuses slices to the desired height without requiring vertical movement of the X-ray tube or the stage.
7. Solder profile feature map: Provides comprehensive systematic information for troubleshooting, Dynamic Range Optimization (DRO)
8. For components with very dark or uneven grayscale levels in X-ray images, high-definition images can still be obtained using the DRO function.
9. Enhanced image clarity: Multiple image enhancement techniques provide clear images for void detection and re-inspection of multi-layer components.
10. 3D CT imaging: Both the V810 machine and the VVTS inspection station can be equipped with 3D model viewing tools.
11. Image restoration function (PSF): Enhances the clarity of 2.5D images to improve test coverage for operators, void algorithm
12. Advanced algorithm with over 20 types of solder joint selections.
13. Phase Shift Profiling (PSP 2): Improves test accuracy and coverage for press-fit connectors and through-hole device boards.
14. New void algorithm: Enhances the accuracy of void detection for various types of components, especially for pad components larger than 1 inch.
15. PTH inspection: The PTH inspection algorithm fully complies with IPC standards for through-hole solder wetting and can slice up to 10 layers to determine the solder wetting height for PTH pins.
16. BGA: Adds three slice layers (totaling six layers) for BGA solder balls, improving the detection rate of HIP defects.
17. Broken pin algorithm: Capable of detecting broken pins in PTH and surrounding areas.
18. Easy re-inspection
ViTrox Verification Tool Solution (VVTS)
ViTrox Verification Tool Solution (VVTS)
A straightforward defect verification tool makes it easier for operators to make accurate judgments.
Images from 14 angle cameras
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19. Automatic defect judgment: Defective solder joints can be automatically judged as faulty without requiring operator re-inspection.
20. Provides reference images of good products: Effectively improves the accuracy of operator re-inspection.
21. Image diagnostics: Highlights void areas and displays the percentage of void area.
22. PTH and BGA 2.5D images: Offers the industry's richest variety of angle images, integrated super server, speed improvement
23. Real-time calculation of precise slice height (PSH): The new PSH function reduces inspection time compared to the previous PSH.
24. Single-core management: Enhances hardware utilization and optimizes the efficiency of multi-core processors.
25. Intelligent optimization of scan path: Optimizes the scan path by intelligently avoiding areas without components.
26. Image Reconstruction Processor (IRP): A more powerful computing processing system reduces image reconstruction processing time.