High-temperature resistant copper foil with low residue and low creep pressure-sensitive adhesive.

High-temperature resistant acrylic pressure-sensitive adhesive, capable of withstanding high temperatures without leaving residue, minimal impact on dyne value, low peel force increase, easy to peel, and residue-free.

High-temperature resistance, no residue or bubbling after cold and hot tearing at 280°C for 1 hour, low peel force increase, no silicon contamination or silicon residue, adjustable peel force from 3g to 1000g, peel force increase after high temperature <2 times, after 10 days at double 85 conditions, peel force <20g, resistant to acids, alkalis, and etching. Suitable for various copper foil process protections, such as FPC processes, lithium battery copper foil processes, and screen film copper foil process protection.

With the continuous development of modern technology, the application of copper foil is becoming increasingly widespread. Today, we not only see copper foil in traditional industries such as circuit boards, batteries, and electronic appliances but also in more cutting-edge fields like new energy, integrated chips, high-end communication, aerospace, and more. Copper foil is also becoming thinner. To facilitate production and processing while protecting the surface of the copper foil film, more and more process steps require protective films. These films must leave no residue and remain easy to remove after processes such as etching, alkaline washing, and high-temperature hot pressing. This demands that the pressure-sensitive adhesive has excellent high-temperature resistance, minimal peel force increase, and be silicon-free to avoid impacting subsequent processes.