High-temperature resistant pressure-sensitive adhesive as a substitute for 3M9077 non-woven double-sided tape

High-temperature resistant acrylic pressure-sensitive adhesive, suitable for 3M9077 tissue paper double-sided tape and non-woven double-sided tape. Withstands 280°C for 1 hour without residue or bubbling after hot/cold peeling, minimal peel force climb, silicone-free pollution & silicone-free residue, adjustable peel force from 30g to 1000g.

A high-temperature resistant pressure-sensitive adhesive alternative to 3M9077, can be coated on non-woven substrates to replace 3M9077.

Used for high-temperature protective films, PI high-temperature protective films, PET high-temperature protective films, PVDF coating protective films, glass process high-temperature protective films, semiconductor high-temperature tapes, semiconductor high-temperature protective films, PCB process protective films, FPC process protective films. Silicone-free pollution, high-temperature resistance, no change in dyne value before and after. PI high-temperature tapes, Teflon tapes, various high-temperature resistant tapes.

Acrylic pressure-sensitive adhesive for FPC high-temperature carrier films, high-temperature resistant without residue.

Pressure-sensitive adhesive for glass coating high-temperature protective films, acrylic pressure-sensitive adhesive, high-temperature resistant without residue.

Pressure-sensitive adhesive for high-temperature protective films, withstands 280°C for 1 hour without residue.

High-temperature resistant pressure-sensitive adhesive, high-temperature resistant acrylic pressure-sensitive adhesive, no residue, high-temperature resistant.

Suitable for flexible circuit board bonding, good thermal shock resistance, excellent adhesion to plastics and plastic spacers. Excellent thermal shock resistance, can be used in high-temperature lead-free processes, its release paper can also pass through reflow soldering, and also features low volatility and easy die-cutting. For example: bonding of flexible circuit boards (through high-temperature reflow soldering).

The release paper will not carbonize even after reflow soldering at 300 degrees Celsius, meeting lead-free industrial requirements.

Double-sided adhesive tape using adhesive and release layer that can withstand high temperatures of lead-free soldering processes (300°C).

Used for fixing FPC and reinforcement boards, FPC and frames.

Double-sided adhesive tape without substrate and tissue paper composite. High heat resistance and good adhesive strength.

The release layer is treated with heat-resistant coating. Has excellent heat resistance, can undergo soldering while the release layer is attached.

1. High-temperature release liner, can withstand a typical lead-free reflow soldering process with peak temperatures up to 500°F (260°C).

2. Ideal for flexible printed circuit (FPC) attachment, in many areas of electronics subjected to high-temperature processing and operating environments.

3. No residue after lead-free reflow.

4. High adhesion, good support, and low outgassing.