High-temperature resistant copper foil pressure-sensitive adhesive with no residue.

High-temperature resistant acrylic pressure-sensitive adhesive, capable of enduring high temperatures without leaving residue, with minimal influence on dyne value, low peel force climb, easy peeling, and no residual adhesive.

High-temperature resistance, no residue or bubbling after cold and hot peeling at 280°C for 1 hour, low peel force climb, no silicon contamination or silicon residue, peel force adjustable from 3g to 1000g, post-high-temperature climb <2 times, after 10 days under dual 85 conditions, peel force <20g, resistant to acids, alkalis, and etching. Suitable for various copper foil process protections, such as FPC processes, lithium battery copper foil processes, and screen film copper foil process protections.

With the continuous development of modern technology, the application of copper foil is becoming increasingly widespread. Today, we not only see copper foil in traditional industries such as circuit boards, batteries, and electronic appliances but also in more cutting-edge fields like new energy, integrated chips, high-end communication, and aerospace. Copper foil is also becoming thinner. To facilitate production and processing while protecting the surface of the copper foil, more and more process steps require protective films. These films must leave no residue and remain easy to remove after processes such as etching, alkaline washing, and high-temperature hot pressing. This demands pressure-sensitive adhesives with excellent high-temperature resistance, low peel force climb, and silicon-free composition to avoid impacting subsequent processes.