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IC Package Conductive Silver Adhesive 84-1A
- Industry Category: Environment/Raw Water Treatment Equipment/Water Supply Equipment
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Price: Negotiable
High Tg Latent Modified Amine Epoxy Curing Agent Comparable to Fuji FXR-1030
- Industry Category: Chemicals/Catalysts & Additives/Curing Agents
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Price: Negotiable
Sensor chip encapsulation protection fluorosilicone gel alternative to Wacker 927F
- Industry Category: Electronic Components & Supplies/Sensors/Displacement Sensors
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Price: Negotiable
Temperature sensor component PPS and metal bonding adhesive
- Industry Category: Machinery & Equipment/Hydraulic Transmission/Temperature Sensors
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Price: Negotiable
Water meter housing sealant CIPG sealant
- Industry Category: Machinery & Equipment/Hydraulic Transmission/Sealant
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Price: Negotiable
IC LED packaging conductive silver adhesive 84-1LMISR4
- Industry Category: Media/IP Equipment/Switches
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Price: Negotiable
Latent Liquid Curing Agent EH-2021
- Industry Category: Chemicals/Catalysts & Additives/Curing Agents
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Price: Negotiable
Latent Epoxy Imidazole Curing Agent Comparable to Ajinomoto PN-23
- Industry Category: Chemicals/Catalysts & Additives/Curing Agents
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Price: Negotiable
Flexible Epoxy Resin EP-4000 Series
- Industry Category: Chemicals/Synthetic Resins/Epoxy Resin
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Price: Negotiable
High-temperature and high-humidity resistant epoxy structural sealant for power semiconductor ceramic packaging
- Industry Category: Machinery & Equipment/Hydraulic Transmission/Sealant
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- Spec:
Price: Negotiable