Chip Packaging Conductive Adhesive 84-1LMI
Price:Negotiable
Contact Info
- Address:松江区松乐路128号, Zip:
- Contact: 陈工
- Tel:13817204081
- Email:hy_ccs168@163.com
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Description
Additional Information
Chip Packaging Conductive Adhesive 84-1LMI
Product Description
LOCTITE ABLESTIK 84-1LMI offers the following product characteristics:
Technology: Epoxy
Appearance: Silver
Curing: Thermal Cure
Product Advantages:
High Electrical Conductivity
Low Bleed
Low Outgassing
Application: Die Attach
pH Value: 5.5
Filler Type: Silver
LOCTITE ABLESTIK 84-1LMI die attach adhesive is used for microelectronic die bonding
Chip Packaging Conductive Adhesive 84-1LMI
| Industry Category: | Chemicals/Adhesives & Sealants/PVA & PVAc Adhesives |
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