1-Adamantyl methacrylate

Core Application Areas and Technical Value

1. Semiconductor and Microelectronic Materials

ArF Photoresist Matrix Resin: When formulated with α-butyrolactone methacrylate (GBLMA) and 3-hydroxy-1-adamantyl acrylate (HADA), it can prepare photoresists with a resolution of 70 nm. Its adamantane structure regulates the dissolution rate through acid-catalyzed deprotection reactions, achieving a development contrast of 4.2 after 193 nm laser exposure, meeting the requirements of 14 nm advanced processes.

Low Dielectric Constant Packaging Materials: Copolymerized with fluoroacrylate, it can prepare packaging resins with a dielectric constant (ε) as low as 2.8, used for 5G chip interconnect layers, reducing signal transmission loss (30% lower than traditional epoxy packaging materials).

2. Optical and Display Materials

High Transparency Heat-Resistant Resin: The homopolymer has a light transmittance of 92% (400-800 nm) and haze < 0.5%, suitable for LED packaging lenses, with no yellowing after long-term use at 150°C (Yellowing Index YI < 1).

VR Device Optical Films: Blended with polycarbonate (PC), it can improve the scratch resistance hardness (pencil hardness 4H) and flexibility (no cracks after 1000 bends at 180°) of the film material, suitable for Fresnel lenses in VR headsets.

3. High-Performance Coatings and Adhesives

High-Temperature Anti-Corrosion Coatings: Copolymerized with silicone acrylate, the resulting coating maintains adhesion (cross-cut test grade 0) at 250°C and salt spray resistance reaches 1000 hours (ASTM B117 standard), used for anti-corrosion of engine exhaust pipes.

UV-Curable Structural Adhesive: Adding 10-15% AdMA can increase the shear strength of the adhesive layer to 28 MPa (aluminum substrate), while maintaining temperature cycle stability from -50°C to 180°C, used for bonding aerospace components.

4. Specialty Polymer Modification

Polyimide (PI) Toughening: Introducing AdMA via copolymerization can reduce the brittleness of PI, increasing the elongation at break from 15% to 45%, while maintaining a glass transition temperature > 280°C, used for flexible display substrates.

Dental Restorative Materials: Formulated with trimethylolpropane trimethylacrylate (TMPTMA), the compressive strength after light curing reaches 300 MPa, approaching natural tooth enamel (350 MPa), and biocompatibility complies with ISO 10993 standards.

CAS NO: 16887-36-8

EC NO:

Molecular Formula: C₁₄H₂₀O₂

Molecular Weight: 220.3074

Alias: ;1-Adamantyl Methacrylate;

Structure: