Dimethyl mixed dibasic ester

Core Application Areas

1. High-Performance Coatings and Inks

Industrial Coatings:

Coil Coatings: Regulate evaporation rate balance, avoid film popping, and improve coating smoothness and flexibility, used for metal surface coating in automobiles, home appliances, etc.

Marine Coatings: Enhance the dispersibility of zinc powder in zinc-rich epoxy primers, extend salt spray test time to over 3000 hours, and meet the heavy anti-corrosion requirements of ships in the Yangtze River basin.

Ink Field:

Flexographic Printing: Improve ink stability, avoid plate clogging, and enhance printing accuracy; serve as a UV ink diluent to balance curing speed and adhesion.

2. Electronic and New Energy Materials

Photoresist Solvent: High-purity DBE (purity ≥99.99%) is used in semiconductor photoresists. Low volatility (evaporation rate is only 0.08 times that of butyl acetate) reduces solvent loss during the coating process and ensures photolithography precision.

Battery Binder: Used as a high-performance solvent in lithium-ion batteries to improve the adhesion and conductivity of electrode materials, reduce battery pack density (weight reduction of 15%), and enhance endurance.

3. Environmentally Friendly Cleaning Agents and Paint Strippers

Industrial Cleaning: Substitute for chlorinated solvents such as trichloroethane, used for degreasing and cleaning metal parts and electronic components, with no residue and excellent biodegradability.

Paint Stripper: Through the synergistic effect of dissolving power and penetrating power, quickly strips old coatings without damaging the substrate.

4. Composite Materials and Adhesives

Carbon Fiber Sizing Agent: Optimize the wettability of resin to fibers, enhance interfacial bonding strength, and increase the interlaminar shear strength of composite materials by 12-18%.

Structural Adhesives: Crosslink with isocyanates or melamine for high-strength bonding of substrates such as metals and plastics, especially suitable for rapid curing in humid environments (curing time reduced by 30%).

CAS NO: 95481-62-2

EC NO:

Molecular Formula: C₂₁H₃₆O₁₂

Molecular Weight: 480.5

Alias: ; Dibasic Acid Ester; DBE; High Boiling Point Solvent (DBE); Dimethyl Nylonate; Dimethyl Nylonate; MADE; Mixed Dibasic Acid Dimethyl Ester; High Boiling Point Solvent MDBE; DBE Dibasic Ester; Ester mixture of diacids C4, C5 and C6 (methyl esters); Mixed Acid Dimethyl Ester; Dibasic Ester; Dibasic Acid Dimethyl Ester;

Structural Formula: