刚性线路板感光型白油

　　Core Application Scenarios and Performance Matching

　　(一) LED Lighting Field

　　Backlight Board

　　Material Selection: PM-500DIW7C/DIW7G White Solder Resist (Reflectivity 88%), reflectivity decay < 3% after OSP and ENIG processes;

　　Process Adaptation: Single printing creates 100×100μm openings, side etch rate < 30%, meeting Mini LED high-density requirements.

　　Display Panel

　　Technical Solution: PSR-4000 FR606WS-HR White Solder Resist (Sulfur-free formula), no discoloration after withstanding LED encapsulant high temperature (180℃).

　　(二) Automotive Electronics Field

　　Vehicle-mounted Display Screen

　　Performance Requirements: Temperature resistance -40℃~150℃, passing ISO 16750-3 vibration test (20-2000Hz, 20g acceleration);

　　Material Innovation: Nano SiO₂ modified white solder resist, solder joint fatigue life extended by 2 times.

　　New Energy Battery BMS

　　Thermal Design: White solder resist with added Boron Nitride (BN), thermal conductivity 0.8W/m・K, reducing circuit board temperature by 15℃.

　　(三) Industrial and Communication Fields

　　5G Base Station RF Board

　　Low Dielectric Loss: Dielectric constant 2.5-3.0 (10GHz), adapting to millimeter-wave frequency band signal transmission;

　　Environmental Requirements: Halogen-free certification (Cl/Br < 900ppm), complying with IPC-4101B standard.

　　Aerospace Equipment

　　Radiation Resistance: Polyimide modified white solder resist can withstand 10⁶Gy dose, dielectric loss < 0.001;

　　Low Stress: Young's modulus 0.1-0.3MPa, absorbing vibration energy to prevent solder joint fracture.