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Low-pressure injection molding Henkel PA2333 hot melt adhesive
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- Brand: 汉高
- Spec: 20公斤
Price: ¥ 130/kg
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JX1300 Low-Pressure Injection Molding Machine for Circuit Board Encapsulation
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- Brand: 东莞集欣
- Spec: JX1300
Price: ¥ 45000
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JX2200 Low-Pressure Injection Molding Machine for Circuit Board Encapsulation
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- Brand: 东莞集欣
- Spec: JX2200
Price: ¥ 35000
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Bostik 865 Low-Pressure Injection Hot Melt Adhesive
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- Product Category:
- Brand: Bostik
- Spec: 20公斤
Price: ¥ 130
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Bostik 817 Low Pressure Injection Hot Melt Adhesive
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- Product Category:
- Brand: Bostik
- Spec: 20公斤
Price: ¥ 130
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Bostik 181 Low-Pressure Injection Hot Melt Adhesive
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- Product Category:
- Brand: Bostik
- Spec: 20公斤
Price: ¥ 130
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Bostik 867HV Low-Pressure Injection Hot Melt Adhesive
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- Product Category:
- Brand: Bostik
- Spec: 20公斤
Price: ¥ 130
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JX1600 Low-Pressure Injection Molding Machine for Circuit Board Encapsulation
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- Brand: 东莞集欣
- Spec: JX1600
Price: ¥ 19000
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PA6211 Low Pressure Injection Hot Melt Adhesive
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- Brand: 汉高
- Spec: 20公斤
Price: ¥ 130/kg
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Injection mold
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- Product Category:
- Brand: 东莞集欣
- Spec:
Price: ¥ 5000
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