Ultra-fine plate-shaped alumina powder for semiconductor packaging grinding, 3μm, comparable to American WCA3.

Ultra-fine Platelet Alumina Powder 3μm for Semiconductor Packaging Grinding, Comparable to US WCA3

PRODUCT/Product: Platelet Calcined Aluminum Oxide / Platelet Alumina

DESCRIPTION/Product Introduction:

Platelet calcined alumina powder, also known as tabulated aluminum oxide grinding powder. It is named after its particle crystal structure being in the shape of scales/flat plates. The crystal form of flake alumina is α-Al2O3, which has high hardness and grinding performance. In the electronics industry, polishing and grinding require high surface precision. To ensure precise grinding effects and yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The surface of the abrasive particles of flake/flat alumina is flat and smooth, and the diameter-to-thickness ratio of the particles can be adjusted by modifying the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches, greatly improving the yield of qualified chips. The production of platelet calcined alumina adopts a high-temperature calcination method to promote lateral crystal growth and form regular hexagonal powders with a tabulated structure. The suspension-treated aluminum oxide grinding powder of platelet shape achieves a uniform particle size distribution, ensuring a fine grinding surface.

Platelet alumina, also known as flat-plate alumina, is named for its scale/flat-plate-shaped particle crystal structure. The crystal form of platelet alumina is α-Al2O3, which exhibits high hardness and grinding performance. In the electronics industry, surface finishing during polishing and grinding demands high precision. To achieve fine grinding results and high product yield, abrasive materials with sharp crystal shapes are no longer sufficient. The abrasive particles of platelet/flat-plate alumina have a smooth and flat surface, and the particle diameter-to-thickness ratio can be adjusted by altering the synthesis method. When grinding semiconductor wafers or other microelectronic components, it is less likely to cause scratches, significantly increasing the yield of qualified chips. The production of platelet alumina employs a high-temperature sintering method to promote lateral crystal growth, forming regular hexagonal powders with a platelet structure. The washed and classified platelet alumina has a highly concentrated particle size distribution, contributing to consistent grinding surface quality.

Platelet calcined alumina powder, also known as tabulated alumina powder. It is named for its particle crystal structure in the shape of scales/plates. Platelet alumina has a crystal form of α-Al2O3 and possesses high hardness and grinding properties. In the electronics industry, polishing and finishing require high surface precision. To ensure precise abrasive effects and productivity, abrasives with sharp crystal shapes no longer meet the requirements. The surface of platelet/flat alumina abrasive particles is flat and smooth, and the particle diameter-to-thickness ratio can be adjusted by modifying the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratching, significantly increasing the production of qualified chips. The production of platelet calcined alumina uses a high-temperature calcination method to promote transverse crystal growth and form regular hexagonal powder with a tabulated structure. After suspension treatment, platelet alumina powder achieves a uniform particle size distribution, ensuring a fine ground surface.

CHEMICAL COMPOSITION/Chemical Composition:

PHYSICAL PROPERTIES/Physical Properties:

PARTICLE SIZE DISTRIBUTION/Particle Size Distribution:

APPLICATIONS/Application Scenarios：

lSemiconductor industry: Grinding and polishing of single crystal silicon wafers, siliceous wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide). / Semiconductor industry: Grinding and polishing of single crystal silicon wafers, silicon-based wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).

lGlass industry: Grinding and processing of crystal, quartz glass, picture tube glass screen, optical glass, LCD glass substrate, and piezoelectric quartz crystals./ Glass industry: Grinding and processing of crystal, quartz glass, cathode-ray tube glass screen, optical glass, LCD glass substrate, and piezoelectric quartz crystals.

lCoating industry: Special coatings and plasma spraying fillers. / Coating industry: Special coatings and plasma spray fillers.

lMetal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc. / Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc.

PACKAGE/Packaging：

10kgs/Bag+20kgs/Carton+1Ton/Pallet / 10kg small bag + 20kg carton + 1 ton pallet