Wafer CMP Planarization Plate-Shaped Alumina Powder 9-11 Micrometers

Platelet Calcined Alumina Powder 9-11 Microns for Wafer CMP Planarization

PRODUCT/Product: Platelet Calcined Aluminum Oxide / Platelet Alumina

DESCRIPTION/Product Introduction:

Platelet calcined alumina powder, also known as tabulated aluminum oxide grinding powder. It is named after its particle crystal structure being in the shape of scales/flat plates. The crystal form of flake alumina is α- Al2O3 has high hardness and grinding performance. In the electronics industry, polishing and polishing require high surface precision. In order to ensure precise grinding effects and yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The surface of the abrasive particles of flake/flat alumina is flat and smooth, and the diameter to thickness ratio of the particles can be adjusted by adjusting the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches, greatly improving the yield of qualified chips. The production of platelet calcined alumina adopts a high-temperature calcined method to promote the lateral growth of crystals and form regular hexagonal powders with a tabulated structure. The suspension treated aluminum oxide grinding powder of platelet shape gets an uniform particle size distribution. That ensure a fine grinding surface.

Platelet alumina is also known as flat-plate alumina, named for its scale/plate-like particle crystal structure. The crystal form of platelet alumina is α-Al2O3, which has high hardness and grinding performance. In the electronics industry, grinding and polishing require high surface precision. To ensure fine grinding results and product yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The abrasive particles of platelet/flat-plate alumina have a flat and smooth surface, and the particle diameter-to-thickness ratio can be adjusted by modifying the synthesis method. When grinding semiconductor wafers or other microelectronic components, it is less prone to scratching, significantly improving the yield of qualified wafers. The production of platelet alumina uses a high-temperature sintering method to promote lateral crystal growth, forming regular hexagonal powders with a platelet structure. The platelet alumina processed through washing and classification has a high degree of particle size concentration, which contributes to consistency in the grinding surface.

Platelet calcined alumina powder, also known as platelet alumina powder. Named for its particle crystal structure in the shape of scales/plates. Platelet alumina has a crystal form of α-Al2O3 and possesses high hardness and grinding properties. In the electronics industry, polishing requires high surface precision. To ensure precise abrasive effects and yield, abrasives with sharp crystal shapes no longer meet the requirements. The surface of platelet/flat alumina abrasive particles is flat and smooth, and the particle diameter-to-thickness ratio can be adjusted by modifying the synthesis method. Grinding semiconductor chips or other microelectronic components is less likely to cause scratches, greatly increasing the production of qualified chips. The production of platelet calcined alumina employs a high-temperature calcination method to promote lateral crystal growth, forming regular hexagonal powder with a tabular structure. After suspension treatment, platelet alumina powder is uniformly distributed. This ensures a fine ground surface.

CHEMICAL COMPOSITION/Chemical Composition:

PHYSICAL PROPERTIES/Physical Properties:

PARTICLE SIZE DISTRIBUTION/Particle Size Distribution:

APPLICATIONS/Application Scenarios：

lSemiconductor industry: Grinding and polishing of single crystal silicon wafers, siliceous wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide). / Semiconductor industry: Grinding and polishing of single-crystal silicon wafers, silicon-based wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).

lGlass industry: Grinding and processing of crystal, quartz glass, picture tube glass screen, optical glass, LCD glass substrate, and piezoelectric quartz crystals./ Glass industry: Grinding and processing of crystal, quartz glass, cathode-ray tube glass screens, optical glass, LCD glass substrates, and piezoelectric quartz crystals.

lCoating industry: Special coatings and plasma spraying fillers. / Coating industry: Special coatings and plasma spray fillers.

lMetal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc. / Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc.

PACKAGE/Packaging：

10kgs/Bag+20kgs/Carton+1Ton/Pallet / 10kg small bag + 20kg carton + 1 ton pallet