Laminated alumina abrasive powder 1200# for front-end surface treatment of silicon wafers, benchmarked against imported Japanese PWA15.

Platelet Alumina Abrasive Powder 1200# for Front-End Surface Treatment of Silicon Wafers, Comparable to Imported Japanese PWA15

PRODUCT/Product: Platelet Calcined Aluminum Oxide / Platelet Alumina

DESCRIPTION/Product Introduction:

Platelet calcined alumina powder, also known as tabulated aluminum oxide grinding powder. It is named after its particle crystal structure being in the shape of scales/flat plates. The crystal form of flake alumina is α-Al2O3, which has high hardness and grinding performance. In the electronics industry, polishing and polishing require high surface precision. To ensure precise grinding effects and yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The surface of the abrasive particles of flake/flat alumina is flat and smooth, and the diameter-to-thickness ratio of the particles can be adjusted by adjusting the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches, greatly improving the yield of qualified chips. The production of platelet calcined alumina adopts a high-temperature calcined method to promote the lateral growth of crystals and form regular hexagonal powders with a tabulated structure. The suspension-treated aluminum oxide grinding powder of platelet shape has a uniform particle size distribution, ensuring a fine grinding surface.

Flake alumina, also known as plate-like alumina, is named for its particle crystal shape being scale/plate-like. The crystal form of flake alumina is α-Al2O3, which has high hardness and grinding performance. In the electronics industry, grinding and polishing require high surface precision. To ensure fine grinding effects and yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The surface of flake/plate-like alumina abrasive particles is flat and smooth, and the particle diameter-to-thickness ratio can be adjusted by modifying the synthesis method. When grinding semiconductor wafers or other microelectronic components, it is less prone to scratching, greatly improving the yield of qualified wafers. The production of flake alumina uses a high-temperature sintering method to promote lateral crystal growth and form regular hexagonal powders with a flake structure. The flake alumina processed by washing and sorting has a high degree of particle size concentration, which is conducive to the consistency of the grinding surface.

Flake calcined alumina powder, also known as flake alumina powder. Named for its particle crystal structure in the shape of scales/plates. Flake alumina has a crystal form of α-Al2O3 and possesses high hardness and grinding properties. In the electronics industry, polishing requires high surface precision. To ensure precise abrasive effects and productivity, abrasives with sharp crystal shapes no longer meet the requirements. The surface of flake/flat alumina abrasive particles is flat and smooth, and the particle diameter-to-thickness ratio can be adjusted by modifying the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches, significantly increasing the production of qualified chips. The production of flake calcined alumina employs a high-temperature calcination method that promotes lateral crystal growth and forms regular hexagonal powder with a tabular structure. After suspension treatment, flake alumina powder is uniformly distributed. This ensures a finely ground surface.

CHEMICAL COMPOSITION/Chemical Composition:

PHYSICAL PROPERTIES/Physical Properties:

PARTICLE SIZE DISTRIBUTION/Particle Size Distribution:

APPLICATIONS/Application Scenarios：

lSemiconductor industry: Grinding and polishing of single crystal silicon wafers, siliceous wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide). / Semiconductor industry: Grinding and polishing of single crystal silicon wafers, silicon-based wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).

lGlass industry: Grinding and processing of crystal, quartz glass, picture tube glass screen, optical glass, LCD glass substrate, and piezoelectric quartz crystals. / Glass industry: Grinding and processing of crystal, quartz glass, cathode-ray tube glass screen, optical glass, LCD glass substrate, and piezoelectric quartz crystals.

lCoating industry: Special coatings and plasma spraying fillers. / Coating industry: Special coatings and plasma spraying fillers.

lMetal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc. / Metal and ceramic processing industry: Precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc.

PACKAGE/Packaging：

10 kgs/Bag + 20 kgs/Carton + 1 Ton/Pallet / 10 kg small bag + 20 kg carton + 1 ton pallet