Microporous Ceramic Vacuum Chuck Porous Ceramic Material

Ceramic vacuum chucks are made from porous ceramic materials with uniformly distributed pores that are interconnected internally. The surface is polished to be smooth, fine, and highly flat, making them widely used in the manufacturing processes of semiconductor wafers such as silicon, sapphire, and gallium arsenide.

① Dense and uniform structure: The microporous ceramic material has a dense and uniform structure, making it less prone to adsorbing silicon powder debris and easy to clean;

② High strength and excellent wear resistance: With the hard characteristics of ceramics, it is wear-resistant, not easily scratched or damaged, and remains deformation-free during grinding, ensuring uniform force distribution on the wafer to prevent chipping or fragmentation;

③ Long lifespan: The surface shape is well-maintained, with long dressing cycles and minimal dressing requirements, resulting in a high service life;

④ High insulation: Made of insulating material, it eliminates static electricity;

⑤ Reusable and easy to dress: During dressing, it does not crack, break, or shed particles. After dressing and polishing, it can be reused within certain limits;

⑥ Resistant to decomposition and dust generation: Ceramics are fully sintered, structurally robust and stable, and do not generate dust;

⑦ Lightweight: Made of lightweight material with a uniformly porous internal structure, it is extremely light;

⑧ Excellent chemical stability: Through material selection and process control, porous ceramic chucks suitable for various corrosive environments can be produced.

Ceramic vacuum chucks are tools for clamping and carrying semiconductor wafers during production. They feature high flatness and parallelism, a dense and uniform structure, high strength, good air permeability, uniform adsorption force, and ease of dressing. They are suitable for processes such as thinning, cutting, grinding, cleaning, and handling in semiconductor wafer manufacturing, effectively addressing issues like wafer imprints, chip electrostatic breakdown, and particle contamination. In practical applications, they achieve extremely high processing quality for semiconductor wafers.