Indium6.6HF Water-Soluble Lead-Free Solder Paste

Indium6.6HF is a versatile water-soluble flux suitable for both tin-lead (SnPb) and lead-free assembly processes, capable of reflowing with air or nitrogen. It features a broad reflow process window, excellent stencil printing performance, long stencil life, and outstanding print pause response.

Indium6.6HF not only delivers top-tier wetting performance on various surfaces but also excels in reducing voids: achieving the lowest void percentage, minimizing the size of large voids, and maintaining extremely low overall void rates on BTC (bottom-termination components such as QFN and D-Pak), BGA, and CSP.

Features
• Low-void water-soluble flux for solder paste
• Fewer voids
• Fewer and smaller large voids
• Extremely low void rates on BTC (bottom-termination components), BGA, and CSP
• Wide printing process window:
• Excellent print pause response
• Long stencil life (over 8 hours in a controlled environment)
• Consistent printing performance at different speeds
• Extremely broad reflow process window
• Excellent wetting on various surfaces
• Very easy to clean
• Long-lasting viscosity stability