VIGON® SC 210 Water-Based Stencil Cleaning Solution

VIGON® SC 210
Water-based stencil cleaning solution for removing solder paste and SMT adhesives
Flux cleaner
VIGON® SC 210 is a water-based cleaning solution for SMT stencil cleaning. It effectively removes both solder paste and SMT adhesives in the same cleaning process. VIGON® SC 210 can be used at lower temperatures, achieving excellent cleaning results even at 18°C. It is suitable for use in spray cleaning equipment and ultrasonic cleaning systems.

Advantages compared to other cleaning solutions:

VIGON® SC 210 delivers stable and effective cleaning performance between 18-40°C
As a water-based solution free of surfactants, it leaves no residue on cleaned parts or equipment
VIGON® SC 210 offers excellent material compatibility
It has no flash point, eliminating the need for additional explosion-proof measures
VOC content is well below 20%, making it easier to comply with VOC emission regulations
VIGON® SC 210 is foam-free with a mild odor, and does not cause organic deposits in cleaning units
Applications
Contaminant removal
Cleaning process
Cleaning technology
Stencil cleaning (low temperature)

Shenzhen Junji Ruixiang Technology Co., Ltd.

Mr. Zeng 13902983965 (same for WeChat)

Email: zengken@sz-cksc.com

Website: www.sz-cksc.com

Address: Room 1807, Oriental Plaza, Jianshe Road, Nanhu Street, Luohu District, Shenzhen