VIGON® PE 200 Power Module Cleaning Solution

VIGON® PE 200
A pH-neutral cleaning solution specifically designed for power modules, power LEDs, lead frames, and discrete devices
Water-based flux cleaner
VIGON® PE 200 is a water-based, pH-neutral cleaning solution developed specifically for spray cleaning processes. Utilizing MPC technology, VIGON® PE 200 effectively removes flux residues from devices such as lead frames, discrete components, power modules, and power LEDs after die attach or heatsink soldering.

Advantages compared to other cleaning solutions:

VIGON® PE 200 provides a clean, activated copper surface, preparing it for subsequent processes such as bonding, molding, and adhesive application.
VIGON® PE 200 maintains the copper surface in an ideal state for a short period.
The product is pH-neutral, ensuring broad material compatibility without affecting the passivation layer on chip surfaces.
Thanks to its MPC formulation, VIGON® PE 200 is easy to rinse.
VIGON® PE 200 has no flash point and does not generate foam, making it suitable for all spray equipment without requiring explosion-proof protection.
Halogen-free and low odor.
Application Areas
Contaminant removal
Cleaning process
Cleaning technology
Power module cleaning
Power LED cleaning
Lead frame cleaning
Discrete device cleaning

Shenzhen Junji Ruixiang Technology Co., Ltd.

Mr. Zeng 13902983965 (same number for WeChat)

Email: zengken@sz-cksc.com

Website: www.sz-cksc.com

Address: Room 1807, Oriental Plaza, Jianshe Road, Nanhu Street, Luohu District, Shenzhen